1) free-lead solder powder of Sn-Ag-Cu system
SnAgCu系无铅焊锡粉末
1.
The experiment studies the effects of atomizing medium on the properties such as efficient atomization efficiency, distribution of size, sphericity of free-lead solder powder of Sn-Ag-Cu system with supersonic atomization equipment designed by ourselves.
利用自行设计的超音速雾化制粉装置,研究不同雾化介质对SnAgCu系无铅焊锡粉末有效雾化率、粒度分布及球形度的影响。
3) Sn-Ag-Cu Lead-free Solder Powder
Sn-Ag-Cu无铅焊锡粉末
4) free-lead solder
无铅焊锡
1.
A mathematic model for evaluating the uncertainty of the determination procedure for silver in free-lead solder in electric apparatus and toys by inductively coupled plasma-atomic emission spectrometry was established.
建立了电感耦合等离子体发射光谱法测定无铅焊锡中银的数学模型,对数学模型中各个参数的不确定度来源进行评定,包括称样质量、配制标准工作溶液、工作曲线拟合、试液定容体积及测量重复性等引入的不确定度。
6) Lead-free material (SnAgCu)
无铅材料(SnAgCu)
补充资料:焊锡
分子式:
CAS号:
性质:熔点较低的焊料。主要指用锡基合金做的焊料。熔融法制锭,压力加工成材
CAS号:
性质:熔点较低的焊料。主要指用锡基合金做的焊料。熔融法制锭,压力加工成材
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条