1.
Effects of Trace Amounts of Element on the Properties and Microstructure of Snagcu Lead-Free Solder Alloy
微量元素对SnAgCu无铅钎料性能和显微组织的影响
2.
Research on the Way to Improve the Solderability of SnAgCu Solder and Reliability of Soldered Joints;
提高SnAgCu无铅钎料润湿性及焊点可靠性途径的研究
3.
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
4.
Morphology of Lead-free SnAgCu Solder Wetting on Cu with Artifical Non-wetting Zone;
微结构铜基底上无铅SnAgCu焊料润湿的形貌研究
5.
DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE
无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测
6.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
7.
Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;
新型无铅钎料钎焊工艺性及机械性能的研究
8.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
9.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
10.
Effect of rare earths elements on properties of SnAgCu solder alloy
稀土元素对SnAgCu钎料性能的影响
11.
Alloys structure and mechanical properties of SnAgCu solder
SnAgCu系钎料的合金组织和力学性能
12.
Effects of Cerium on Microstructure and Properties of SnAgCu Solders
铈对SnAgCu钎料的显微组织和性能影响
13.
Study on Soldering Procedure and Joint Properties of Down Quenching SnAgCu Solder Alloy
急冷型SnAgCu系钎料合金钎焊工艺及接头性能研究
14.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
15.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
16.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
17.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
18.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究