1) SnAgCu system
SnAgCu系
1.
The mechanical property and solder ability of SnAgCu system lead-free solder alloys were studied by means of optical microscopy, scanning electron microscopy(SEM), energy dispersive X-ray(EDX) and Instron electrohydraulic servo fatigue tensile tester.
利用光学显微镜、扫描电子显微镜(SEM)和能谱分析仪(EDX)及Instron电液伺服疲劳拉伸试验机,对SnAgCu系无铅钎料合金的力学性能和钎焊性能进行了研究。
2) SnAgCu alloy system
SnAgCu合金系
3) free-lead solder powder of Sn-Ag-Cu system
SnAgCu系无铅焊锡粉末
1.
The experiment studies the effects of atomizing medium on the properties such as efficient atomization efficiency, distribution of size, sphericity of free-lead solder powder of Sn-Ag-Cu system with supersonic atomization equipment designed by ourselves.
利用自行设计的超音速雾化制粉装置,研究不同雾化介质对SnAgCu系无铅焊锡粉末有效雾化率、粒度分布及球形度的影响。
4) SnAgCu solder
SnAgCu钎料
1.
In situ observation and research on electrochemical migration of SnAgCu solder joints;
SnAgCu钎料焊点电化学迁移的原位观察和研究
2.
Effect of rare earths elements on properties of SnAgCu solder alloy
稀土元素对SnAgCu钎料性能的影响
6) SnAgCu solder joints
SnAgCu焊点
1.
The dissertation performs systemic study on the electronic test methods about evaluating SnAgCu solder joints reliability in the circumstance of thermal load and analyze the feasibility with an in-situ micro electronic-resistance measurement, including integrated analysis of the damag.
本文采用微电阻测量的手段,研究在热载荷条件下SnAgCu焊点可靠性评估的电测方法,并进行可行性分析。
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条