1.
Effect of inner diameter of delivery tube end of atomizer on morphology and size distribution of free-lead solder powder
雾化器导液管内径对无铅焊锡粉末形貌及粒度分布的影响
2.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
3.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
4.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
5.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
6.
Effect of Cerium on Microstructure and Properties of Lead-free Solder Alloy
Ce对无铅焊锡合金组织及性能的影响
7.
tin-lead 60-40 solder
锡铅60-40焊料
8.
Soldering materials are our major products, especially in Lead Free Soldering Materials.
焊锡物料是我们的主要产品，特别是无铅焊锡物料。
9.
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
10.
Corrosion Research of Different Lead Free Wave Solder Pot Materials;
无铅波峰焊不同锡炉材料溶蚀行为研究
11.
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
12.
Application of Hydroxy-alkyl-amine to Lead-free Solder Paste
烷基羟基胺在无铅焊锡膏制备中的应用
13.
Research Progress and Development Tendency of Tin-based Lead-free Electronic Solder
锡基无铅电子焊料的研究进展与发展趋势
14.
Q: How do I keep my employees from mixing lead-free and leaded solder and equipment on the line?
在有铅和无铅焊锡混合应用的生产线上，怎样进行设备和物料管理？
15.
No white power occurring on soldered surface or surface of the components, no moisture absorption.
焊锡表面和零件面无白粉产生、无吸湿性。
16.
Casting tin-lead solders
GB/T8012-1987铸造锡铅焊料
17.
The Improvement of the Solder Paste Performance and the Effect of Composition on It;
SMT无铅焊锡膏性能的改进及其组份对性能的影响
18.
Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loading
应变率效应对无铅焊锡接点跌落冲击力学行为的影响