1)  SnAgCu lead-free solder
SnAgCu无铅焊料
2)  Sn
Sn
1.
Effects of Ce and Sn on Microstructure of AZ91 Magnesium Alloy;
Ce、Sn对AZ91合金微观组织的影响
2.
Effects of Sn and Ca Addition on Microstructural Stability of ZA62 Magnesium Alloy;
Sn和Ca对ZA62合金组织稳定性的影响
3.
Effects of Trace Si,Ba and Sn on the As-cast Microstructure of AZ91 Magnesium Alloy;
微量Si、Ba、Sn对AZ91铸态组织的影响
3)  tin
Sn
1.
Measurements of release sound velocities of tin with reverse-impact method;
反向碰撞法测量Sn的高压卸载声速
2.
The oxidation behviours of liquid tin with and without trace Ge at 250℃in atmo- sphere were studied by both observation and removing dross from the surface periodically.
采用观察液态Sn表面氧化行为和刮取表面氧化渣的方法,研究了微量元素Ge对液态Sn在大气和250℃条件下表面抗氧化性能的影响,并与纯Sn的氧化行为进行对比;利用X射线光电子能谱仪(XPS)、扫描电子显微镜(SEM)研究了合金表面元素的含量、价态,及合金氧化后的表面形貌。
3.
Based on Atomic and Molecular Reaction Statics and Group theory, the basis sets SDD~(**) for Tin and 6-311g~(**) for H_2, and density functional (B3P86) method have been used to calculate energy E, heat capacity C_v, entropy S of hydrogen isotopes and their Tin compounds.
根据原子分子反应静力学与群论,确定了H2、D2和T2的基电子状态为1∑+g(D∞v),SnH、SnD和SnT的基电子状态为2∑+(C∞v)。
4)  In-Sn
In-Sn
1.
WETTING BEHAVIOR AND INTERFACIAL CHARACTERISTICS OF In-Sn ALLOY ON AMORPHOUS AND CRYSTALLINE Cu_(46)Zr_(45)Al_7Gd_2 SUBSTRATES;
In-Sn合金熔体在非晶和晶态Cu_(46)Zr_(45)Al_7Gd_2合金上的润湿性及界面特性
5)  Sn(Ⅱ)
Sn（Ⅱ）
1.
The Direct Electrochemical Synthesis of Sn(Ⅱ),Pb(Ⅱ) Complexes of 2, 4-Dichlorobenzaldehyde Thiosemicaebazone;
4-二氯氯苯甲醛氨基硫脲与Sn（Ⅱ），Pb（Ⅱ）的配合物。
6)  isomers
Sn-
1.
Several isomers of sulfur clusters were acquired by means of geometry optimization and frequency calculations of the B3LYP DFT approach.
另外也计算了螺旋状的Sn- (n = 14~20)的结构。
参考词条
补充资料：铅焊料
分子式：
CAS号：

性质：以铅为基的一类铅合金。有铅锡、铅银两大类。常见铅锡焊料合金有Pb-50%Sn-0.5%Sb, Pb-40%, Sn-1.7%Sb, Pb-30%SN-1.7%Sb, Pb-25%Sn-1.7%Sb, Pb-18%Sn-1.7%Sb, Pb-4%Sn-5%Sb等。用于电器、电子、机械部门。铅银焊料合金有Pb-2.5%Ag, Pb-1.2%Ag, Pb-1.5%Ag-1.5%Sn, Pb-0.6%Ag等，是属高温焊料。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。