1)  Sn-Ag
Sn-Ag
1.
Attention should be paid to the research and application of Sn-Zn and Sn-Ag based solders, and the value of adding microalloy and rare-earth elements to the lead-free solders as well.
全球禁铅运动的发展使得无铅技术已提上各国议事日程,针对这一形势,笔者概述了近几年来国内外无铅焊接的研究动态与发展趋势,特别介绍了无铅钎焊的软钎料开发的最新研究成果,并指出了该领域中值得关注的Sn-Ag与Sn-Zn系钎料的开发价值与应用前景,同时指出添加微量合金和稀土元素对无铅软钎料开发的意义。
2.
Discuss the application and requirement of the lead-free solder,which covers Sn-Ag,Sn-Zn,Sn-Bi and so on,meanwhile,discuss the effect of other element in those three solders.
介绍了无铅焊料的应用现状及无铅的使用要求,并论述了几种无铅焊料Sn-Ag、Sn-Zn、Sn-B i系的特点,以及添加其它元素对它们综合性能的影响。
3.
The present paper introduces current developed lead-free solders based on Sn-Ag、Sn-Zn and Sn-Bi, and analyzes choice and influence factor of lead-free solders in electronic asse.
论述了无铅焊料Sn-Ag、Sn-Zn、Sn-Bi系的特点,分析了无铅焊料在电子装配应用中的选择及影响因素,研究了清洗溶剂的使用特点,为实现高可靠性的电子装配工作提供了现实依据。
2)  Sn-Ag-Cu alloy
Sn-Ag-Cu合金
1.
Studies on electrodeposition behavior of Sn-Ag-Cu alloy;
Sn-Ag-Cu合金电沉积行为的研究
2.
The electroplating process for Sn-Ag-Cu alloy coatings in weak acid bath is optimized.
对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右。
3.
The effect of the concentrations of main salts and the process conditions on the compositions,and the morphologies of Sn-Ag-Cu alloy electrodeposits were investigated by X-ray fluorescence(XRF) and scanning electron microscopy(SEM).
研究表明,Sn-Ag-Cu合金的电沉积是正则共沉积。
3)  Sn-Ag-Cu
Sn-Ag-Cu
1.
Study on the Reliability of Sn-Ag-Cu Lead-free Solders;
Sn-Ag-Cu无铅焊料的可靠性研究
2.
Influence of Trace Rare Earth Elements on the Property of Sn-Ag-Cu Lead-Free Solder;
添加微量稀土元素对Sn-Ag-Cu系无铅焊料性能的影响
3.
Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering;
半导体激光软钎焊Sn-Ag-Cu焊点微观组织
4)  Sn-Ag-Bi-Cu-In
Sn-Ag-Bi-Cu-In
1.
Study of New-type Sn-Ag-Bi-Cu-In Lead-free Solders;
新型Sn-Ag-Bi-Cu-In系无铅钎料合金研究
5)  Sn-Ag-Sb
Sn-Ag-Sb
1.
Research and Development of Sn-Ag-Sb Lead-free Based Solders;
无铅焊料Sn-Ag-Sb系列合金的研究与开发
2.
Wetting Ability of Sn-Ag-Sb and Sn-Zn-In Lead-free Based Solders;
无铅Sn-Ag-Sb与Sn-Zn-In润湿性研究
3.
Effect of Rare Earth Elements on Microstructure and Solder/Cu Interfacial Microstrueture of Sn-Ag-Sb;
微量稀土元素对Sn-Ag-Sb系合金组织及焊料/Cu界面组织的影响
6)  Sn-Ag-Cu solder
Sn-Ag-Cu钎料
参考词条
补充资料：sneezing agent
分子式：
CAS号：

性质：以鼻、喉的刺激症状为主的刺激性毒剂，如亚当氏剂。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。