2) pure Sn coating
纯Sn镀层
1.
Temperature cycling tests were executed to assess the reliability of pure Sn coating.
当器件经历500与1 000次温度循环后,纯Sn镀层表面会产生致密的热疲劳裂纹,伴随生长出许多锡须。
2.
In this study,some Cu leads with pure Sn coating in TO220 packaging were executed the temperature cycling(TC) tests to research their behaviors of whisker growth.
采用TO220封装的电子元件,研究了在温度循环条件下,元件Cu引脚上纯Sn镀层的Sn须生长行为。
3) electroless plating tin
化学镀Sn
1.
By means of SEM, XRD, EDX, volume of hydrogen evolution,the physical and chemical properties of current collector with electroless plating tin and electroplating tin technique were studied.
通过扫描电子显微镜(SEM)、X射线衍射(XRD)、X射线荧光(EDX)、析氢量测试等多种方法对化学镀Sn铜钉和电镀Sn铜钉的物理化学特性进行了研究,结果表明采用化学镀Sn方法获得的Sn层结晶更细小致密,析氢量更低,能够显著提高无汞碱锰电池的防漏性能和贮存性能。
4) Sn-Bi films
Sn-Bi镀层
1.
Sn-Bi films were electrodeposited on Cu substrate from a sulphate bath.
采用硫酸盐镀液在铜基体上电沉积Sn-Bi镀层,利用能谱仪(EDS)、扫描电子显微镜(SEM)和X射线衍射仪(XRD)研究了电沉积参数对镀层成分和微观结构的影响。
5) tin coating
Sn镀层
1.
Welding failure analysis of tin coating for the terminal electrode of MLCC
MLCC端电极Sn镀层的焊接失效分析
6) Sn Pb alloy electroplating
Sn-Pb合金电镀
补充资料：(-)-2,3-O-Isopropylidene-sn-glycerol
分子式：C6H12O3
分子量：132.16
CAS号：14347-78-5
性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
分子量：132.16
CAS号：14347-78-5
性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条