Sn-Pb,Sn-Pb,在线英语词典,英文翻译,专业英语

1) Sn-Pb

Sn-Pb

Shear strengths of rectangular chip component soldered with Sn-Pb solder and with Sn-Ag-Cu solder were studied by means of STR-1000 micro-joints tester and microscopic fractography by SEM.

采用微焊点强度测试仪测试了Sn-Ag-Cu钎料和Sn-Pb钎料钎焊的矩形片状元件钎焊接头的抗剪强度,并对焊点断口进行了扫描电镜分析。

2) Sn-Pb

锡铅

High Speed Eeectroplating Bright Sn-Pb& Sn-Pb-Co Alloy Bath on Copper Wire in Fluoroborate Plating Bath;

铜线材氟硼酸盐高速电镀光亮锡铅及锡铅钴合金

3) Sn-Pb alloy

Sn-Pb合金

Bright Sn-Pb alloy electroplating technology with citric acid and EDTA as the complexing agent, and QB-1 as the additive was studied.

研究了以柠檬酸和EDTA为络合剂,QB-1为添加剂的电镀光亮Sn-Pb合金工艺。

Concentrates of Hydroxyalkylsulfonates of Sn and Pb for Sn-Pb alloy electroplating developed and produced in China have been used by some factories in productin.

我国自行研制生产的羟基烷基磺酸电镀Sn-Pb合金镀液已经在部分厂家投产使用。

Therefore, the Sn-Pb alloy loaded polymer composites have many special properties for their low melting point, which are not held by usual materials.

与通常的金属相比，Sn-Pb(Tm=183℃)合金具有较低的熔点，在通常的聚合物的加工温度窗口能够实现固态与液态之间的转变，因此如果选用Sn-Pb合金作为填料，制得的聚合物基复合材料能够在制备和使用的过程中实现刚性粒子和可变形液滴之间的转变，填料物态的转变会给复合材料带来一些特殊的性能。

4) Sn-Pb solder

Sn-Pb钎料

The traditional Sn-Pb solder alloys and other solder alloys based on Pb have lowly mechanical properties except for their poison.

传统的Sn-Pb钎料及Pb基软钎料除有毒外,还存在力学性能方面的问题。

5) Sn-Pb solder

锡铅钎料

6) bright Sn-Pb alloy

光亮锡-铅合金

The technology of the bright Sn-Pb alloy electroplating on aluminum and aluminum alloy with the pretreatment method of zinc-nickel immersion plating and nickel pre-electroplating was studied.

研究了采用浸锌-锡合金与预镀镍相结合的方法,在铝及其合金表面形成一层中间层再电镀光亮锡-铅合金工艺。

参考词条

Sn Pb alloy electroplating HL610 Sn-Pb solder Sn Pb alloy Sn-Pb alloy electroplating Sn-Pb alloy deposit bright Sn-Pb alloy Sn-Pb eutectic Sn/Pb dopping Sn-Pb solder joint Sn-Pb-Zn solder Sn-Pb welding powder Sn-Pb /Ni interfacial reactions Sn-Pb-Zn polymetallic deposit Tin saved Sn-Pb solder Sn-Pb-Au-Sb alloy Bi-Sn-Pb-Cd system vacuum furnace for separting Pb from Sn-Pb alloy 溶胶-凝胶法/无机膜 EMS主动控制

补充资料：[N,N-bis[2-[bis(carboxymethyl)amino]ethyl]glycinato(5-)]-, diammonium, (PB-7-13-12564)-Ferrate(2-)

CAS: 85959-68-8
分子式: C14H18FeN3O10·2H4N

中文名称: N,N-二[2-[二(羧甲基)氨基]乙基]甘氨酸基合铁(2-)二胺盐

英文名称: [N,N-bis[2-[bis(carboxymethyl)amino]ethyl]glycinato(5-)]-, diammonium, (PB-7-13-12564)-Ferrate(2-)
ferrate(2-), [rel-[n(r)]-n-[2-[bis[(carboxy-.kappa.o)methyl]amino-.kappa.n]ethy
l]-n-[2-[(s)-[(carboxy-.kappa.o)methyl](carboxymethyl)amino-.kappa.n]ethyl]glyc
.kappa.o]-, diammonium, (pb-7-13-12564)-inato(5-)-.kappa.
Ferrate(2-),[N,N-bis[2-[bis(carboxymethyl)amino]ethyl]glycinato(5-)]-,diammonium,(PB-7-13-12564)-

说明：补充资料仅用于学习参考，请勿用于其它任何用途。

首页 \| 翻译 \| 影视 \| 论坛 \| 索引 Sn-Pb-Co alloy Sn-Pb-Co

1) Sn-Pb Sn-Pb 1. Shear strengths of rectangular chip component soldered with Sn-Pb solder and with Sn-Ag-Cu solder were studied by means of STR-1000 micro-joints tester and microscopic fractography by SEM. 采用微焊点强度测试仪测试了Sn-Ag-Cu钎料和Sn-Pb钎料钎焊的矩形片状元件钎焊接头的抗剪强度,并对焊点断口进行了扫描电镜分析。 2) Sn-Pb 锡铅 1. High Speed Eeectroplating Bright Sn-Pb& Sn-Pb-Co Alloy Bath on Copper Wire in Fluoroborate Plating Bath; 铜线材氟硼酸盐高速电镀光亮锡铅及锡铅钴合金 3) Sn-Pb alloy Sn-Pb合金 1. Bright Sn-Pb alloy electroplating technology with citric acid and EDTA as the complexing agent, and QB-1 as the additive was studied. 研究了以柠檬酸和EDTA为络合剂,QB-1为添加剂的电镀光亮Sn-Pb合金工艺。 2. Concentrates of Hydroxyalkylsulfonates of Sn and Pb for Sn-Pb alloy electroplating developed and produced in China have been used by some factories in productin. 我国自行研制生产的羟基烷基磺酸电镀Sn-Pb合金镀液已经在部分厂家投产使用。 3. Therefore, the Sn-Pb alloy loaded polymer composites have many special properties for their low melting point, which are not held by usual materials. 与通常的金属相比，Sn-Pb(Tm=183℃)合金具有较低的熔点，在通常的聚合物的加工温度窗口能够实现固态与液态之间的转变，因此如果选用Sn-Pb合金作为填料，制得的聚合物基复合材料能够在制备和使用的过程中实现刚性粒子和可变形液滴之间的转变，填料物态的转变会给复合材料带来一些特殊的性能。 4) Sn-Pb solder Sn-Pb钎料 1. The traditional Sn-Pb solder alloys and other solder alloys based on Pb have lowly mechanical properties except for their poison. 传统的Sn-Pb钎料及Pb基软钎料除有毒外,还存在力学性能方面的问题。 5) Sn-Pb solder 锡铅钎料 6) bright Sn-Pb alloy 光亮锡-铅合金 1. The technology of the bright Sn-Pb alloy electroplating on aluminum and aluminum alloy with the pretreatment method of zinc-nickel immersion plating and nickel pre-electroplating was studied. 研究了采用浸锌-锡合金与预镀镍相结合的方法,在铝及其合金表面形成一层中间层再电镀光亮锡-铅合金工艺。参考词条 Sn Pb alloy electroplating HL610 Sn-Pb solder Sn Pb alloy Sn-Pb alloy electroplating Sn-Pb alloy deposit bright Sn-Pb alloy Sn-Pb eutectic Sn/Pb dopping Sn-Pb solder joint Sn-Pb-Zn solder Sn-Pb welding powder Sn-Pb /Ni interfacial reactions Sn-Pb-Zn polymetallic deposit Tin saved Sn-Pb solder Sn-Pb-Au-Sb alloy Bi-Sn-Pb-Cd system vacuum furnace for separting Pb from Sn-Pb alloy 溶胶-凝胶法/无机膜 EMS主动控制补充资料：[N,N-bis[2-[bis(carboxymethyl)amino]ethyl]glycinato(5-)]-, diammonium, (PB-7-13-12564)-Ferrate(2-) CAS: 85959-68-8 分子式: C14H18FeN3O10·2H4N 中文名称: N,N-二[2-[二(羧甲基)氨基]乙基]甘氨酸基合铁(2-)二胺盐英文名称: [N,N-bis[2-[bis(carboxymethyl)amino]ethyl]glycinato(5-)]-, diammonium, (PB-7-13-12564)-Ferrate(2-) ferrate(2-), [rel-[n(r)]-n-[2-[bis[(carboxy-.kappa.o)methyl]amino-.kappa.n]ethy l]-n-[2-[(s)-[(carboxy-.kappa.o)methyl](carboxymethyl)amino-.kappa.n]ethyl]glyc .kappa.o]-, diammonium, (pb-7-13-12564)-inato(5-)-.kappa. Ferrate(2-),[N,N-bis[2-[bis(carboxymethyl)amino]ethyl]glycinato(5-)]-,diammonium,(PB-7-13-12564)- 说明：补充资料仅用于学习参考，请勿用于其它任何用途。
©2008 dictall.com