1)  Sn-Bi
Sn-Bi
1.
The present paper introduces current developed lead-free solders based on Sn-Ag、Sn-Zn and Sn-Bi, and analyzes choice and influence factor of lead-free solders in electronic asse.
论述了无铅焊料Sn-Ag、Sn-Zn、Sn-Bi系的特点,分析了无铅焊料在电子装配应用中的选择及影响因素,研究了清洗溶剂的使用特点,为实现高可靠性的电子装配工作提供了现实依据。
2)  Sn-Bi alloy
锡铋合金
1.
Directly Pouring the Sn-Bi Alloy Pattern or Press Die by Using a Prototype Made of Paper;
用快速成形纸质铸型浇注锡铋合金模具
2.
The process of acidic Sn-Bi alloy electroplating was developed by Hull cell tests.
采用赫尔槽试验研究了硫酸盐酸性电镀锡铋合金工艺。
3.
Semisolid Sn-Bi alloy slurry can be obtained by mechnical stirring technology.
采用机械搅拌技术制备锡铋合金半固态浆料,研究了搅拌温度、搅拌时间对锡铋半固态合金组织和力学性能的影响。
3)  Sn-Bi alloy
Bi-Sn合金
4)  Sn-Bi-X
Sn-Bi-X
5)  Sn-Bi alloy
Sn-Bi合金
1.
Reversibility of liquid-liquid transition in Sn-Bi alloys;
Sn-Bi合金熔体可逆液-液结构转变的研究
2.
Effects of Rotating Magnetic Field on Microstructure of Sn-Bi Alloy;
旋转磁场对Sn-Bi合金凝固组织的影响
6)  Sn-Bi-welding
锡铋焊
1.
Apply the Sn-Bi-welding to recondition the chromium-plated layer of vertical posts and jacks;
运用锡铋焊技术修复立柱、千斤顶镀铬层
参考词条
补充资料：(-)-2,3-O-Isopropylidene-sn-glycerol
分子式：C6H12O3
分子量：132.16
CAS号：14347-78-5

性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。

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