1) Sn whisker
Sn须
1.
Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling;
温度循环条件下电镀液配方对镀层Sn须生长的影响
2.
Sn whisker growth in TC conditions had in a high rate,a high density and a uniform length.
采用TO220封装的电子元件,研究了在温度循环条件下,元件Cu引脚上纯Sn镀层的Sn须生长行为。
2) tin whisker
Sn晶须
1.
Study on tin whisker growth of SnAgCuLa solder alloy surface;
SnAgCuLa钎料合金表面Sn晶须的生长研究
2.
Study of tin whisker growth accelerated by rare earth Y
稀土Y加速Sn晶须生长规律
3) Sn whisker growth
Sn须生长
1.
With lead-free requirement and size miniature in electronic product field,Sn whisker growth becomes a more serious problem in electronic packaging interconnecting and affects electronic products reliability and security.
随着电子产品行业的无铅化以及其尺寸的微型化,在电子产品的封装互连中,Sn焊料凸点的Sn须生长成为制约电子产品的可靠性和使用安全性的一大瓶颈。
4) Sn whisker
Sn晶须
1.
Formation of Sn whiskers from ball milled powder at room temperature
室温下球磨粉体中Sn晶须的自发生长
2.
0Er solder alloy are oxidized when exposed in air,and it was found that Sn whiskers can rapidly grow on the oxidized ErSn_3.
暴露于空气中ErSn_3将发生氧化,同时在其表面会出现Sn晶须的快速生长现象。
5) tin
[英][tɪn] [美][tɪn]
Sn
1.
Measurements of release sound velocities of tin with reverse-impact method;
反向碰撞法测量Sn的高压卸载声速
2.
The oxidation behviours of liquid tin with and without trace Ge at 250℃in atmo- sphere were studied by both observation and removing dross from the surface periodically.
采用观察液态Sn表面氧化行为和刮取表面氧化渣的方法,研究了微量元素Ge对液态Sn在大气和250℃条件下表面抗氧化性能的影响,并与纯Sn的氧化行为进行对比;利用X射线光电子能谱仪(XPS)、扫描电子显微镜(SEM)研究了合金表面元素的含量、价态,及合金氧化后的表面形貌。
3.
Based on Atomic and Molecular Reaction Statics and Group theory, the basis sets SDD~(**) for Tin and 6-311g~(**) for H_2, and density functional (B3P86) method have been used to calculate energy E, heat capacity C_v, entropy S of hydrogen isotopes and their Tin compounds.
根据原子分子反应静力学与群论,确定了H2、D2和T2的基电子状态为1∑+g(D∞v),SnH、SnD和SnT的基电子状态为2∑+(C∞v)。
补充资料：须阇提
【须阇提】
（人名）(参见：须阇多)。
（人名）(参见：须阇多)。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条