1) Sn-Ag-Cu Lead-free Solder Powder
Sn-Ag-Cu无铅焊锡粉末
2) Sn-Ag-Cu lead-free joints
Sn-Ag-Cu无铅焊点
3) lead-free solder of Sn-Ag-Cu
Sn-Ag-Cu系无铅焊料
5) Sn-Ag-Cu lead-free solder
Sn-Ag-Cu无铅钎料
1.
Wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate were tested by diode laser soldering system,influence of different soldering parameters on wettability and spreadability of Sn-Ag-Cu lead-free solder was studied.
采用半导体激光软钎焊系统对Sn-Ag-Cu无铅钎料在Cu基体上进行了润湿铺展性能实验,研究了半导体激光工艺参数对Sn-Ag-Cu无铅钎料润湿铺展性能的影响规律。
6) Sn-Ag-Cu lead-free alloy
无铅合金Sn-Ag-Cu
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条