1) Sn-Ag-Cu alloy
Sn-Ag-Cu合金
1.
Studies on electrodeposition behavior of Sn-Ag-Cu alloy;
Sn-Ag-Cu合金电沉积行为的研究
2.
The electroplating process for Sn-Ag-Cu alloy coatings in weak acid bath is optimized.
对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右。
3.
The effect of the concentrations of main salts and the process conditions on the compositions,and the morphologies of Sn-Ag-Cu alloy electrodeposits were investigated by X-ray fluorescence(XRF) and scanning electron microscopy(SEM).
研究表明,Sn-Ag-Cu合金的电沉积是正则共沉积。
2) Ag-Cu-Sn-In alloy
Ag-Cu-Sn-In合金
3) Ag-Cu-In-Sn alloy
Ag-Cu-In-Sn合金
4) Ag-Cu-Ge-Sn alloy
Ag-Cu-Ge-Sn合金
5) Sn-Ag-Cu ternary alloy
Sn-Ag-Cu三元合金
1.
In this paper, electroplating processes and electrodeposit mechanism of lead-free Sn-Ag-Cu ternary alloy coatings from weak acid baths were studied.
本文研究了在弱酸性甲磺酸盐-碘化物体系中电沉积无铅可焊性Sn-Ag-Cu三元合金镀层工艺,并初步探讨了沉积机理。
6) Sn-Ag-Cu lead-free alloy
无铅合金Sn-Ag-Cu
补充资料：(+)-2,3-O-Isopropylidene-sn-glycerol
分子式：C6H12O3
分子量：132.16
CAS号：22323-82-6
性质：密度1.07。沸点82-83°C (14 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度11° (c=5, CH3OH)。水溶性miscible。
分子量：132.16
CAS号：22323-82-6
性质：密度1.07。沸点82-83°C (14 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度11° (c=5, CH3OH)。水溶性miscible。
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参考词条