1.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
2.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析
3.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
4.
Effect of Ag and Ni on melting temperature and spreadability of Sn-SbCu solder alloy
Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响
5.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
6.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
7.
Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements
纳米结构强化的新型Sn-Ag基无铅复合钎料
8.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
电沉积制备Sn-Cu无铅钎料电镀工艺的研究
9.
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
10.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
11.
Microstructure,Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead-Free Solders
Sn-Cu基多组元无铅钎料组织、性能及界面反应研究
12.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
13.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
14.
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
15.
Study on Indentation Creep Behavior of the Sn-Ag-Bi Lead-free Solder;
Sn-Ag-Bi无铅焊料压入蠕变性能的研究
16.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
17.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
18.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究