1) Sn/Cu ratio
Sn/Cu比
1.
For investigating A15 phase formation kinetics of Nb3Sn superconductors four sets of mono-element internal-Sn (MEIT) wires were designed and fabricated, which have different Sn/Cu ratio and 1at% Zr addition in one wire.
这四组MEIT导线设计了不同的Sn/Cu比,并在一组导线中合金化掺杂了1at%Zr。
2) Cu-Sn alloy
Cu-Sn合金
1.
Rapid dendritic growth in melt-spun Cu-Sn alloys;
急冷条件下Cu-Sn合金的快速枝晶生长
2.
Microstructural morphology and phase structure of rapidly solidified Cu-Sn alloy;
快速凝固Cu-Sn合金的组织形态及相结构
3.
Preparation and improvement of Cu-Sn alloy negative electrode for lithium ion batteries;
锂离子蓄电池用Cu-Sn合金负极的制备及改性
3) lead-free solder
Sn-Cu-Ni
1.
Effects of N_2 protection on wettability of Sn-Cu-Ni-Ce lead-free solder;
氮气保护对Sn-Cu-Ni-Ce无铅钎料润湿性的影响
4) Sn-Cu solder
Sn-Cu钎料
1.
Effect of Cu content on IMC between Sn-Cu solder and Cu and Ni substrates;
铜含量对Sn-Cu钎料与Cu、Ni基板钎焊界面IMC的影响
5) Sn-Ag-Cu series
Sn-Ag-Cu系
1.
Measurement of mechanical properties of Sn-Ag-Cu series lead-free solder alloy by using micro-indentation;
微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能
6) Cu-Zn-P-ZnCr_2S_4
Cu-Sn-P-ZnCr_2S_4
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条