1.
The Experiment and Theoretics Study of Viscosity of Cu-Sn Alloys;
Cu-Sn合金熔体粘度的实验与理论研究
2.
Study on rapid solidification welding techniques of quenched Cu-Sn alloy foils
急冷Cu-Sn合金箔快速凝固连接工艺
3.
The Preparation and Mechanisms Study of Cu-Sn Alloy Coated Ferrous Powder
Cu-Sn合金包覆铁粉末的制备及机理研究
4.
Preparation of Cu-Sn alloy anodes by reductive co-precipitation method and their electrochemical performance
Cu-Sn合金共还原法制备及电化学性能研究
5.
Microstructural characteristic of rapid solidification welding joint of melt-spun Cu-Sn peritectic alloy foils
急冷Cu-Sn合金的快速凝固焊接接头组织特征
6.
Study on Synthesis of RE-IV-VI Diluted Magnetic Semiconductors and on the Phase Diagrams of La-Cu-Sn System;
稀土-IV-VI族稀磁半导体材料的合成与La-Cu-Sn合金相图研究
7.
Study on the Microstucture and the Mechanical and Electrical Properties of Copper-tin Alloy Wires Prepared by Heated-mold Continuous Casting Process;
热型连铸技术制备Cu-Sn合金线材及其组织与性能分析
8.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
9.
Research on the Directionally Solidified Microstructure of Cu-Sn Peritectic Alloys;
Cu-Sn包晶合金定向凝固组织研究
10.
Process for Electroplating of Pb-Sn-Cu Ternary Alloy Coating
Pb-Sn-Cu合金共沉积工艺研究
11.
Microstructure and Properties of Rapidly Solidified Cu-Sn Hypoperitectic Alloys;
快速凝固Cu-Sn亚包晶合金的微观结构与性能
12.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
13.
Research on Properties of Sn-Ag-Cu Solder Alloy Doped with Sb;
掺杂Sb的Sn-Ag-Cu系焊料合金性能的研究
14.
Research on Electroplating Techonology and Mechanism of Sn-Ag-Cu Alloy Coatings;
电沉积Sn-Ag-Cu合金工艺及沉积机理研究
15.
Microstructure of Al-20% Sn-4.5% Cu alloy during high energy ball milling and sintering processes
Al-20% Sn-4.5% Cu合金在高能球磨和烧结中的组织
16.
Effect of Cu,As and Sn on the low ductility region Ⅲ of low alloy steel continuous casting slabs
Cu、As和Sn对低合金钢连铸坯第Ⅲ脆性区的影响
17.
The Reversibility of Liquid Structure Transition of Cu-Sn/Sb and Pb-Bi/Sb Alloys and Its Effects on Solidification
Cu-Sn/Sb及Pb-Bi/Sb合金熔体结构转变的可逆性及其对凝固的影响
18.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比