2) SnAgCu solder
SnAgCu钎料
1.
In situ observation and research on electrochemical migration of SnAgCu solder joints;
SnAgCu钎料焊点电化学迁移的原位观察和研究
2.
Effect of rare earths elements on properties of SnAgCu solder alloy
稀土元素对SnAgCu钎料性能的影响
5) SnAgCu alloy system
SnAgCu合金系
6) brazing alloy
钎料合金
1.
Effect of alloying elements on microstructure and property of AgCuZnSn brazing alloy;
合金元素对AgCuZn系钎料合金组织与性能的影响
2.
Effect of P and rare-earth La on microstructure and property of AgCuZnSn brazing alloy;
P,稀土La对AgCuZnSn钎料合金组织与性能的影响
3.
The melting temperature was measured by a microscale DTA analyzer and the microstructure and welding performance of the brazing alloy were studied by metallographic and SEM analysis together with X-ray energy spectrum analysis.
使用微量型DTA差热分析仪测定钎料合金的熔化温度,并通过金相观察和扫描电镜观察结合X射线能谱分析对钎料合金的组织和焊接性能进行研究。
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条