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1)  Bi5Sb solder alloy
Bi5Sb钎料合金
1.
A new BiSbCu ternary alloy was formed by adding different contents of Cu into Bi5Sb solder alloy to improve its wettability and mechanical properties.
结果表明:在Bi5Sb钎料合金中添加0。
2)  brazing alloy
钎料合金
1.
Effect of alloying elements on microstructure and property of AgCuZnSn brazing alloy;
合金元素对AgCuZn系钎料合金组织与性能的影响
2.
Effect of P and rare-earth La on microstructure and property of AgCuZnSn brazing alloy;
P,稀土La对AgCuZnSn钎料合金组织与性能的影响
3.
The melting temperature was measured by a microscale DTA analyzer and the microstructure and welding performance of the brazing alloy were studied by metallographic and SEM analysis together with X-ray energy spectrum analysis.
使用微量型DTA差热分析仪测定钎料合金的熔化温度,并通过金相观察和扫描电镜观察结合X射线能谱分析对钎料合金的组织和焊接性能进行研究。
3)  solder alloy
钎料合金
1.
Design of lead-free solder alloy and alloy phase diagram calculation;
无铅锡基钎料合金设计和合金相图及其计算
2.
5Ag solder alloy and conducted under different loading waveforms at room temperature.
5Ag钎料合金进行了不同加载波形下的单轴应变循环实验。
3.
7Cu solder alloy is selected out by comprehensive comparison.
7Cu系钎料合金为基础,添加少量的RE,研究RE添加量对合金组织、力学及物理性能的影响,以确定最佳RE添加量。
4)  Sn2.5Ag0.7CuXRE solder alloy
Sn2.5Ag0.7CuXRE钎料合金
5)  SnAgCuRE solder alloy
SnAgCuRE钎料合金
1.
The strength property of the material and its microstructure and strength property of the joint are researched based on the SnAgCuRE solder alloy fabricated under vacuum condition.
对真空条件下制备的SnAgCuRE钎料合金的力学性能及其钎焊接头的组织与性能进行了研究。
6)  silver brazing alloys
银合金钎料
补充资料:[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式:C16H16ClN3O3S
分子量:365.5
CAS号:26807-65-8

性质:暂无

制备方法:暂无

用途:用于轻、中度原发性高血压。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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