1.
Effect of procedure conditions on characteristics of SnAgCu alloyed powder prepared by gas atomization
工艺条件对气雾化制备SnAgCu合金粉末特性的影响
2.
Study on IMC Growth in SnAgCu/Cu Interfacial;
SnAgCu/Cu界面金属间化合物长大规律
3.
Alloys structure and mechanical properties of SnAgCu solder
SnAgCu系钎料的合金组织和力学性能
4.
The Study on Reactive Wettability of SnAgCu Solder Alloy on Au/NiFe/Cu PAD
SnAgCu钎料合金在Au/NiFe/Cu焊盘上的反应润湿研究
5.
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
6.
Study on Soldering Procedure and Joint Properties of Down Quenching SnAgCu Solder Alloy
急冷型SnAgCu系钎料合金钎焊工艺及接头性能研究
7.
Research on Effects of Minute Amount of Rare-earth Element Ce on Properties of SnAgCu Alloy and Reliability of Soldered Joints;
微量稀土Ce对SnAgCu钎料合金性能的影响及焊点可靠性的研究
8.
Effect of soldering parameters on the soldered joint microstructure performance of the down quenching SnAgCu solder alloy
工艺参数对急冷型SnAgCu系钎料合金钎焊接头组织性能的影响
9.
Effect of rare earths elements on properties of SnAgCu solder alloy
稀土元素对SnAgCu钎料性能的影响
10.
Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint
回流焊对SnAgCu焊点IMC及剪切强度的影响
11.
Study of active substance for SnAgCu lead-free solder paste
SnAgCu无铅焊膏用活性物质研究
12.
Effects of Cerium on Microstructure and Properties of SnAgCu Solders
铈对SnAgCu钎料的显微组织和性能影响
13.
Effects of Rosin Resin on Properties of SnAgCu Solder Paste
松香树脂对SnAgCu焊膏性能的影响
14.
Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate
微量Ce对SnAgCu焊料与铜基界面IMC的影响
15.
Morphology of Lead-free SnAgCu Solder Wetting on Cu with Artifical Non-wetting Zone;
微结构铜基底上无铅SnAgCu焊料润湿的形貌研究
16.
The Effect of RE Content on Creep and Aging Properties of Low Ag Content SnAgCu Solder Joints;
RE对低银SnAgCu焊点蠕变及时效特性的影响
17.
Effects of Trace Amounts of Element on the Properties and Microstructure of Snagcu Lead-Free Solder Alloy
微量元素对SnAgCu无铅钎料性能和显微组织的影响
18.
DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE
无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测