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1)  Pb-free solder plating
无铅焊料镀层
1.
This paper describes the development background,kinds,required characleristic,processes and future theme of Pb-free solder plating.
概述了无铅焊料镀层的开发背景、种类、要求的特性、工艺和今后的课题。
2)  lead-free solderable coating
无铅可焊镀层
1.
The introduction is focused on Sn-Ag nanometer particles composite coaoting as a lead-free solderable coating including the electroplating bath, pH value, the results of Hull Cell test and solderablility test.
重点介绍Sn- Ag纳米微粒复合镀层做为无铅可焊镀层的溶液、p H值、霍氏槽及可焊性试验的结果 ;还介绍了具有装饰和优良憎水性的镍 -聚四氟乙烯微粒复合镀层。
3)  lead-free coating
无铅镀层
1.
Effect of N_2 on wettability of Sn-Ag-Cu solder on components/devices lead frame and lead-free coating;
N_2对Sn-Ag-Cu钎料与元器件引线无铅镀层润湿性的影响
4)  Pb-free solder
无铅焊料
1.
This paper describes the development background,kinds,required characleristic,processes and future theme of Pb-free solder plating.
概述了无铅焊料镀层的开发背景、种类、要求的特性、工艺和今后的课题。
5)  lead-free solder
无铅焊料
1.
Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy;
稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响
2.
Effect of cerium on the structure and properties of Sn-Ag-Cu lead-free solder;
Ce对SnAgCu系无铅焊料合金组织和性能的影响
3.
Properties of Sn-Zn alloys as lead-free solders;
亚共晶Sn-Zn系合金无铅焊料的性能
6)  lead-free [英][,led 'fri:]  [美]['lɛd 'fri]
无铅焊料
1.
RoHS law endorsed by EU on electronic products quickens the tendency of lead-free solders.
文章对无铅焊料的发展过程,Sn-Ag-Cu合金的性能进行了综述,重点介绍了Sn-Ag-Cu焊点的可靠性,包括试验法和有限元法。
2.
Recently,lead-free solders are replacing Sn-Pb solders because of human health and the environmental protection and legal regulation worldwide.
近年来环境和人类健康保护的要求和有关国际法规的压力使世界电子工业面临以无铅焊料代替传统锡铅焊料的迫切需求。
补充资料:铅焊料
分子式:
CAS号:

性质:以铅为基的一类铅合金。有铅锡、铅银两大类。常见铅锡焊料合金有Pb-50%Sn-0.5%Sb, Pb-40%, Sn-1.7%Sb, Pb-30%SN-1.7%Sb, Pb-25%Sn-1.7%Sb, Pb-18%Sn-1.7%Sb, Pb-4%Sn-5%Sb等。用于电器、电子、机械部门。铅银焊料合金有Pb-2.5%Ag, Pb-1.2%Ag, Pb-1.5%Ag-1.5%Sn, Pb-0.6%Ag等,是属高温焊料。

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