1.
Study on Lead-free Weldable Coating of Chip Electronic Components
片式电子元器件中无铅可焊镀层的研究
2.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
3.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
4.
Reliability analysis of PBGA devices with different finishes under hygrothermal environment in lead-free electronics package
无铅封装中镀覆层对PBGA耐湿热可靠性的影响
5.
The Technology and Equiment of Hot Dip Plating Pb Sn Alloy on a Double Wall Brazed Tube
双层卷焊钢管热浸镀铅锡合金工艺与设备
6.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析
7.
Thermal reliability optimization study on PBGA lead-free solder joint
PBGA无铅焊点热可靠性优化研究
8.
Determination of Pb and Cd in the Coating of the Zinc-Coated Steel Sheets by ICP-AES;
ICP-AES法测定镀锌板中镀层的铅和镉
9.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
10.
Fatigue-Life Predicyion for Lead-Free Solder Joints and Study for Effect of IMC on Reliability of Solder Joints;
无铅焊点寿命预测及IMC对可靠性影响的研究
11.
Board Level Lead-Free Solder Joints Reliability Analysis under Drop Shock Loading;
板级无铅焊点跌落冲击载荷下可靠性分析
12.
Finite Element Simulation and Life Prediction for Reliability of Lead-free Solder in PBGA;
PBGA无铅焊点可靠性的有限元模拟与寿命预测
13.
Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;
电子封装中无铅焊点的界面演化和可靠性研究
14.
Research on the Theory & Experiments of SMT Lead-Free Solder Joint Reliability under Drop Impact;
跌落碰撞下SMT无铅焊点可靠性理论与实验研究
15.
Mechanism and Reliability of Lead Free Joints Fabricated by Low Temperature Ultrasonic Bonding
无铅焊点低温超声互连的机理及可靠性研究
16.
Study on the Properties and Reliability of Sn-Zn-Bi-Cr Lead-Free Solder
Sn-Zn-Bi-Cr无铅焊料的性能与可靠性研究
17.
This workshop covers lead-free surface finishes for components, connectors and print circuit board.
这次课程涵盖了元件、接器和印刷电路板的无铅表面镀层。
18.
Metallic coatings--Electroplated coatings of tin-lead alloys
GB/T17461-1998金属覆盖层锡--铅合金电镀层