1) Lead-free Solder Bump
无铅焊料凸点
2) lead-free solder joint
无铅焊点
1.
Reliability of lead-free solder joint for FCOB in hygrothermal environment;
湿热环境下倒装焊无铅焊点的可靠性
2.
Effect of Sb doped SnAgCu lead-free solder joint on electromigration reliability;
Sb掺杂对SnAgCu无铅焊点电迁移可靠性的影响
3.
Failure analysis of lead-free solder joints based on resistance strain critical point
基于电阻应变临界点的无铅焊点失效分析
3) lead-free solder joints
无铅焊点
1.
Development of creep resistance test system for lead-free solder joints;
无铅焊点蠕变电阻测试系统的研制
2.
An AOI algorithm for transistor lead-free solder joints of SMT post-reflow
SMT炉后晶体管类元件无铅焊点的自动光学检测算法
3.
Through appearance testing,X-Ray testing and temperature cycling testing,the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.
通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
4) Pb-free solder
无铅焊料
1.
This paper describes the development background,kinds,required characleristic,processes and future theme of Pb-free solder plating.
概述了无铅焊料镀层的开发背景、种类、要求的特性、工艺和今后的课题。
5) lead-free solder
无铅焊料
1.
Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy;
稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响
2.
Effect of cerium on the structure and properties of Sn-Ag-Cu lead-free solder;
Ce对SnAgCu系无铅焊料合金组织和性能的影响
3.
Properties of Sn-Zn alloys as lead-free solders;
亚共晶Sn-Zn系合金无铅焊料的性能
6) lead-free
[英][,led 'fri:] [美]['lɛd 'fri]
无铅焊料
1.
RoHS law endorsed by EU on electronic products quickens the tendency of lead-free solders.
文章对无铅焊料的发展过程,Sn-Ag-Cu合金的性能进行了综述,重点介绍了Sn-Ag-Cu焊点的可靠性,包括试验法和有限元法。
2.
Recently,lead-free solders are replacing Sn-Pb solders because of human health and the environmental protection and legal regulation worldwide.
近年来环境和人类健康保护的要求和有关国际法规的压力使世界电子工业面临以无铅焊料代替传统锡铅焊料的迫切需求。
补充资料：铅焊料
分子式：
CAS号：
性质：以铅为基的一类铅合金。有铅锡、铅银两大类。常见铅锡焊料合金有Pb-50%Sn-0.5%Sb, Pb-40%, Sn-1.7%Sb, Pb-30%SN-1.7%Sb, Pb-25%Sn-1.7%Sb, Pb-18%Sn-1.7%Sb, Pb-4%Sn-5%Sb等。用于电器、电子、机械部门。铅银焊料合金有Pb-2.5%Ag, Pb-1.2%Ag, Pb-1.5%Ag-1.5%Sn, Pb-0.6%Ag等，是属高温焊料。
CAS号：
性质：以铅为基的一类铅合金。有铅锡、铅银两大类。常见铅锡焊料合金有Pb-50%Sn-0.5%Sb, Pb-40%, Sn-1.7%Sb, Pb-30%SN-1.7%Sb, Pb-25%Sn-1.7%Sb, Pb-18%Sn-1.7%Sb, Pb-4%Sn-5%Sb等。用于电器、电子、机械部门。铅银焊料合金有Pb-2.5%Ag, Pb-1.2%Ag, Pb-1.5%Ag-1.5%Sn, Pb-0.6%Ag等，是属高温焊料。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条