1) wafer pre-alignment
硅片预对准
1.
At first,the architecture of the wafer pre-alignment system is designed according to its task and flow.
介绍了所研制的12 in硅片预对准系统。
2) Wafer Pre-alignment Principles
硅片预对准原理
3) Si wafer
硅片
1.
Micro-occur of Si wafer under rotating disk test has been studied.
利用自制旋转圆盘空蚀试验装置,以流动自来水为介质,对磨片、化抛片、抛光片和刻蚀片等4种硅片进行连续8 h试验以及对磨片进行连续14 h跟踪观察试验,研究硅材料的微观破坏过程,并利用扫描电子显微镜、触针式表面形貌仪和原子力显微镜对其表面微观形貌进行分析。
2.
A vacuum clamp equipment used for holding Si wafer is designed in this paper.
设计了一套硅片专用真空夹紧装置,包括夹紧装置和微型无油真空抽气泵。
3.
Microstrip circuits with s parameters on different resistance Si wafers are investigated and created a physics model of five-layer microstrip circuits.
对不同电阻率硅片射频微带电路S参数进行了模拟研究。
4) silicon wafer
硅片
1.
Progress of multi-wire saw for precision slicing of silicon wafer;
硅片精密切割多线锯研究进展
2.
Evaluation of efficiency for silicon wafer cleaning by image processing;
利用图像处理技术评价硅片表面清洗率
3.
Experimental and theoretical study on laser cleaning Al_2O_3 particle on silicon wafer surface;
激光清洗硅片表面Al_2O_3颗粒的试验和理论分析
5) silicon chip
硅片
1.
Experimental study of bending silicon chip with long pulse width laser;
长脉宽脉冲激光硅片弯曲成形试验
2.
Experimental Study on Laser Bending of Thin Silicon Chip;
薄硅片材料的激光弯曲试验研究
3.
The silicon chip is a main component of the semiconductor apparatus;there is extensive application in printing the integrated circuit and miniature integrated instrument.
硅片是半导体器材的主要元件,在印刷集成电路及微型集成仪表中有着广泛应用。
6) silicon
硅片
1.
Study on anisotropic etching of silicon in hydrazine;
肼对硅片的各向异性腐蚀技术研究
参考词条
补充资料：设备安装前的准备工作——设备的预装配与预调整
设备安装前的准备工作——设备的预装配与预调整 | ||
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。