1) Silver
镀银层
1.
Study on Silver Electroplating of Titanium;
对钛合金进行喷砂、酸洗、氢化及预镀铜等前处理工艺后 ,可获得厚度大于 2 5 μm ,结合力良好的镀银层 ,并对沉积机理进行简单的探讨。
2) silver plating
镀银
1.
Technical specification in cyanide silver plating;
氰化镀银工艺中的几个技术问题
2.
Acoording to the surface appearance and the microhardness of coating,the parameters of silver plating with pulse current are optimized by the rthorhombic experiment.
以镀层表面形貌和显微硬度为考核指标,采用正交试验法优选了脉冲镀银参数,采用优选的脉冲参数电镀与直流电镀的银镀层作了比较。
3) silver electroplating
镀银
1.
The working principle and main functions of a silver electroplating line is briefly introduced.
简要介绍镀银生产线的工作原理及主要功能。
2.
In order to improve its conductivity, silver electroplating was applied.
详细介绍了在铍青铜上电镀银的工艺过程，并提出了几种对所得银镀层进行防变色处理的方法。
4) cyanide bath for Ag electroplating
镀银液
5) electroless silver plating
化学镀银
1.
Optimization of electroless silver plating process on carbon fiber fabric;
碳纤维布化学镀银工艺的优化
2.
Study on the influence of electroless silver plating on hollow glass microsphere by using surfactants;
表面活性剂对空心玻璃微珠化学镀银影响的研究
3.
Application of electroless silver plating to metallization of material surface;
化学镀银在材料表面金属化中的应用
6) immersion silver
浸镀银
1.
Deposition process of immersion silver plating onto copper substrate in silver nitrate aqueous solution;
铜基材硝酸银溶液浸镀银的沉积过程
2.
Finishing of printed circuit board in ethylenediamine-containing immersion silver system;
印刷电路板的乙二胺络合浸镀银工艺
3.
The electrodeposition rate of immersion silver plating for printed circuit board(PCB) was measured by galvanic current method via advance electrochemical system.
利用先进的电化学系统,通过测定铜-银电偶电流,分别对有无络合剂条件下印刷电路板浸镀银的沉积速度进行测定,并将测定结果与常规的容量滴定法进行对比。
参考词条
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