1) cyanide-free silver plating
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无氰镀银
1.
Technical characteristics and existing problems of cyanide-free silver plating technology were summarized through the analysis of cyanide-free silver plating systems of thiosulfate,succinimide,iodide,hydantoin,sulfite and others.
通过对硫代硫酸盐、丁二酰亚胺、碘化物、乙内酰脲、亚硫酸盐以及其它无氰镀银体系的分析,总结了当前无氰镀银工艺的技术特点及存在的问题,并阐述了无氰镀银技术的发展历程和研究现状。
2.
Ten typical formulas and some kinds of additives used for cyanide-free silver plating were introduced.
综述了十种典型的无氰镀银工艺配方和无氰镀银所采用的添加剂类型。
3.
of silver plating;obtaining an optimum component proportion in sodium thiosutphate Cyanide-free silver plating.
本文研究了硫代硫酸钠无氰镀银工艺镀液组分的变化对银镀层在附着力、光亮度等性能方面的影响,从而得到硫代硫酸钠无氰镀银工艺的最佳镀液配方。
2) cyanide-free silver electroplating
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无氰镀银
1.
A cyanide-free silver electroplating process with 5,5-dimethyl hydantoin as coordination agent is studied.
研究了5,5-二甲基乙内酰脲为配位剂的无氰镀银工艺。
3) non-cyanide silver plating
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无氰电镀银
1.
Process of non-cyanide silver plating for molybdenum foils used as inter-links of solar cell array system in space vehicle
航天器太阳能电池阵互连片钼箔无氰电镀银工艺
4) cyanide silver plating
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氰化镀银
1.
The formulation and operation conditions of cyanide silver plating were introduced, and a blackening agent formulation with jet black finish on silver surface and its post-treatment process were presented.
介绍了氰化镀银配方及操作条件,给出了一种银上着色深的黑化剂配方及其后处理工艺。
5) non-cyanide plating
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无氰电镀
1.
This paper focused on the influence of non-cyanide plating solution stability,the electroplating parameters on th.
本文主要对无氰电镀共沉积制备金锡合金凸点的方法进行了研究,内容包括镀液稳定性,电镀参数对镀层的影响以及Au70Sn30共晶凸点的制各方法等,通过研究发现: 1。
2.
The non-cyanide plating has been obtained successfully.
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无氰电镀已取得了巨大的成功,但在镀层结合强度方面还存在一些问题,"电位活化"概念给出了理论解释。
6) cyanide-free copper plating
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无氰镀铜
1.
Advances in experimental study and production practice of cyanide-free copper plating—Part I
无氰镀铜的实验研究与生产应用进展(一)
2.
Research and application of cyanide-free copper plating has made a certain progress and obtained effective achievements,but it still exists problem of low adhesion as plating on iron and steel substrates.
无氰镀铜的研究应用已取得一定的进展和成效,但在钢铁基体上镀铜仍存在结合力差的问题。
补充资料:1-邻氰苯乙烯基-4-对氰苯乙烯基苯
分子式:C24H16N2
分子量:332.40
CAS号:13001-38-2
性质:熔点181-186°C。水溶性insoluble。
分子量:332.40
CAS号:13001-38-2
性质:熔点181-186°C。水溶性insoluble。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条