1) silver plated copper powder
镀银铜粉
1.
The relationship between the surface's unit resistance of the film with contents of silver plated copper powder and its particle size,and the contents of coupling agent were studied.
介绍了导电漆、作为导电填料的片状镀银铜粉的制备工艺流程。
2) silver-coated copper powder
镀银铜粉
1.
The silver-coated copper powder was prepared with substitution reaction method.
采用置换反应法制备镀银铜粉时,铜粉还原银氨溶液中的Ag+生成的Cu2+与NH3形成络合物[Cu(NH3)4]2+,它吸附于铜粉表面而阻碍还原反应的继续进行,使制备的镀银铜粉表层的银含量降低。
3) Silver plating copper powder
镀银铜粉
1.
A composite conductive paint based on silver plating copper powder and epoxy resin was developed, and the effects of silver plating copper powder and coupling agent on the conductivity of paint were discussed.
研究了以镀银铜粉为导电填料的电子浆料,讨论了镀银铜粉含量、硅烷偶联剂的用量以及处理方法对导电浆料导电性能的影响。
4) silverplated copper
镀银铜粉
1.
A powder with high conductivity was obtained by mechanical alloying of silverplated copper powder.
本文经过对镀银铜粉的球磨处理（以下简称ＣＭ处理粉），得到一种高导电性的粉体，由该导电粉制得的导电胶不仅导电率高、耐湿性好，而且耐银迁移性是银粉导电胶的１００倍。
2.
Electrondonating amine additives were complexed with exposed copper surfaces of milled silverplated copper powder.
低价格、耐金属迁移的铜粉或镀银铜粉导电胶研究和开发越来越受到工业界重视，但铜粉或裸露铜表面的易氧化性却是制约其应用的一大难题。
5) micron silver coated copper powder
微米级镀银铜粉
1.
A new method was suggested to characterize the anti oxidation capability of micron silver coated copper powder in normal temperature.
提出了一种新的方法来表征微米级镀银铜粉的常温抗氧化性能 ,即通过测定镀银铜粉稀硫酸浸泡液的透光率大小来进行表征。
6) silrer plating copper IVD
镀银铜IVD
补充资料：还原铜粉
还原铜粉
由氧化铜经过还原反应而得的铜粉 c+2cuo=co2+2cu
说明：补充资料仅用于学习参考，请勿用于其它任何用途。