2) QFN device
QFN器件
1.
QFN devices were exposed in hygro-thermal environment for 17 h,50 h and 96 h,and moisture diffusion into QFN devices was analyzed and simulated,to build a wet-stress calculation model.
选用QFN器件作为研究对象,首先进行QFN器件在高温高湿环境下吸潮17 h、50 h、96 h试验;然后利用有限元软件分析和模拟潮湿在QFN器件中的扩散行为,并建立湿气预处理阶段应力计算模型;最后,通过试验与仿真相结合,分析潮湿对封装可靠性的影响。
3) PEM
塑封器件
1.
The Failure of PEM Caused by the Mismatch of CTE;
热膨胀系数不匹配导致的塑封器件失效
2.
PEMs are reputed to offer significant cost,availability,size and weight advantages,but someone still focuses on reliability issues.
但是还是有相当一部分人对于塑封器件的可靠性持怀疑态度。
3.
Based on this, high accelerate stress test (HAST) were done to evaluate the reliability of PEM devices, the proposal from Goddard center of NASA which screen the high reliability PEM devices were introduced.
针对影响塑封器件可靠性的五种失效机理,即腐蚀失效、爆米花效应、低温/温冲失效、闩锁以及工艺缺陷等方面进行分析和讨论,并提出利用高温潮热和温度冲击试验对塑封器件的可靠性进行评估。
4) plastic encapsulated microcircuits (PEM)
塑封器件
1.
With the persistent improvements in quality and reliability, the application of plastic encapsulated microcircuits (PEM) became more widespread, even including the military field.
随着塑封器件(PEMs)质量和可靠性的不断提高,塑封器件的应用领域进一步扩展,也逐步应用于军事领域。
5) Plastic Packaging Device
塑封器件
1.
Influence of combining thermal-humidity and vapor pressure on the reliability for plastic packaging device
集成湿热及蒸汽压力对塑封器件可靠性的影响
补充资料：[styrene-(2-vinylpyridine)copolymer]
分子式：
分子量：
CAS号：
性质：学名苯乙烯-2-乙烯吡啶共聚物。微黄色粉末或透明小颗粒晶体。无臭，无味。不溶于水，溶于酸、乙醇、丙酮、氯仿。有抗水、防潮性能，适用于多种药片的包衣等。
分子量：
CAS号：
性质：学名苯乙烯-2-乙烯吡啶共聚物。微黄色粉末或透明小颗粒晶体。无臭，无味。不溶于水，溶于酸、乙醇、丙酮、氯仿。有抗水、防潮性能，适用于多种药片的包衣等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条