1) plastic device
塑料封装器件
2) plastic capsulation
塑料封装
1.
In the paper,resin material,the transfer molding mechanism,craft process and control as well as the mold of plastic capsulation of microelectronic components are analyzed and researched.
对微电子塑料封装所用树脂材料、树脂的传递、模塑成型机理、工艺过程及控制、塑料封装所采用的模具作了分析研究,将封装材料、工艺过程和模具设计三者紧密联系起来,为微电子塑料封装相关企业提供一个合理的参考依据。
3) plastic package
塑料封装
1.
The finite element analysis on moisture diffusion in microelectronic plastic packages during moisture preconditioning by using a commercial FEA software is studied and modeled.
塑料封装器件暴露在一定的潮湿环境下将会吸收潮湿的现象已经得到广泛的认同。
2.
A new kind of pulse laser on tunnel junction with plastic package is reported.
报道了一种新型塑料封装隧道结脉冲半导体激光器。
4) PEM
塑封器件
1.
The Failure of PEM Caused by the Mismatch of CTE;
热膨胀系数不匹配导致的塑封器件失效
2.
PEMs are reputed to offer significant cost,availability,size and weight advantages,but someone still focuses on reliability issues.
但是还是有相当一部分人对于塑封器件的可靠性持怀疑态度。
3.
Based on this, high accelerate stress test (HAST) were done to evaluate the reliability of PEM devices, the proposal from Goddard center of NASA which screen the high reliability PEM devices were introduced.
针对影响塑封器件可靠性的五种失效机理,即腐蚀失效、爆米花效应、低温/温冲失效、闩锁以及工艺缺陷等方面进行分析和讨论,并提出利用高温潮热和温度冲击试验对塑封器件的可靠性进行评估。
5) plastic encapsulated microcircuits (PEM)
塑封器件
1.
With the persistent improvements in quality and reliability, the application of plastic encapsulated microcircuits (PEM) became more widespread, even including the military field.
随着塑封器件(PEMs)质量和可靠性的不断提高,塑封器件的应用领域进一步扩展,也逐步应用于军事领域。
6) Plastic Packaging Device
塑封器件
1.
Influence of combining thermal-humidity and vapor pressure on the reliability for plastic packaging device
集成湿热及蒸汽压力对塑封器件可靠性的影响
补充资料：环氧塑料封装产品
环氧塑料封装产品
翻坛刁 获魏簇蕊}产吧竺i环‘塑\
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条