1.
Influence of EMC Material Property Parameters on Thermal Stress of QFN
EMC材料特性参数对QFN器件热应力的影响
2.
Effects of Moisture on the Reliability of QFN Device in Hygro-Thermal Environment
湿热环境下吸潮对QFN器件可靠性的影响研究
3.
Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method
基于CZM法QFN器件热冲击载荷下的界面脱层研究
4.
Reliability sensitivity analysis of the QFN device based on Monte Carlo method
基于蒙特卡罗法的QFN器件可靠性灵敏度分析
5.
The effects of combining thermal-humidity and vapor pressure on delamination of plastic packaging QFN component
集成湿热及蒸汽压对塑封QFN器件的层裂影响
6.
The Design and Implementation of QFN Inspection Software Base on Machine Vision;
基于机器视觉的QFN芯片检测软件的设计与实现
7.
Thermal Reliability Analysis for QFN based on Factorial Experimental Design
基于析因实验设计的QFN热可靠性分析
8.
Finite element analysis on soldered joint reliability of QFN device
QFN封装焊点可靠性的有限元分析
9.
Resolve A Problem of Dissipate Heat for Led’s Display with QFN
利用QFN封装解决LED显示屏散热问题
10.
Crossed-field devices(M-type devices)
正交场器件(M型器件)
11.
a ROM software component
只读存储器软件元件.
12.
electrical parts of machinery or apparatus
机器或设备的电器零件
13.
fuse for protection of semiconductor device
保护半导体器件熔断器
14.
CCD canceller
电荷耦合器件对消器
15.
specimen-holder assembly
样品（支持）器组件
16.
N-P-N-P three junction device
npnp三结器件n-p-n-p三结器件
17.
on line memory device
联机存储器件 联机存储器件
18.
Finite Element Analyses of Some Photon and MEMS Devices;
典型光子器件和MEMS器件的有限元分析