1.
The effects of combining thermal-humidity and vapor pressure on delamination of plastic packaging QFN component
集成湿热及蒸汽压对塑封QFN器件的层裂影响
2.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
3.
The Design and Implementation of QFN Inspection Software Base on Machine Vision;
基于机器视觉的QFN芯片检测软件的设计与实现
4.
Influence of EMC Material Property Parameters on Thermal Stress of QFN
EMC材料特性参数对QFN器件热应力的影响
5.
Effects of Moisture on the Reliability of QFN Device in Hygro-Thermal Environment
湿热环境下吸潮对QFN器件可靠性的影响研究
6.
Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method
基于CZM法QFN器件热冲击载荷下的界面脱层研究
7.
Reliability sensitivity analysis of the QFN device based on Monte Carlo method
基于蒙特卡罗法的QFN器件可靠性灵敏度分析
8.
General specification for electronic components plastic packaging equipments
GB/T13947-1992电子元器件塑料封装设备通用技术条件
9.
Simulation of Mechanical Behavior of Plastic Electronic Package under Temperature and Humidity Environment;
温湿度条件下塑封电子器件力学行为的模拟
10.
Optimal design of plastic electronic packaging component based on BP neural network
基于BP神经网络的模塑封电子器件优化设计
11.
Influence of combining thermal-humidity and vapor pressure on the reliability for plastic packaging device
集成湿热及蒸汽压力对塑封器件可靠性的影响
12.
Finite element analysis on soldered joint reliability of QFN device
QFN封装焊点可靠性的有限元分析
13.
Resolve A Problem of Dissipate Heat for Led’s Display with QFN
利用QFN封装解决LED显示屏散热问题
14.
Study on the Accelerated Soak Testing during Reliability Evaluation of Semiconductor Plastic Package
半导体塑封器件在可靠性试验中加速浸润方法的研究
15.
Study on Optimal Design Method for Micro-electronic Packaging Device Based on Artificial Neural Network
基于人工神经网络的微电子塑封器件的优化设计方法研究
16.
Effect of deionized water and NaCl solution on property of electronic component storage
去离子水和5%NaCl溶液浸泡对塑封电子器件的影响
17.
A Study on Electrochemical Corrosion Induced by Delamination during Hydrothermal Aging in Plastic Encapsulated Power Device
塑封功率器件在湿热老化试验中分层导致的电化学腐蚀的分析
18.
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析