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1)  SMD plastic package semiconductor device
SMD塑封半导体器件
2)  Plastic semiconductor device
塑料半导体器件
3)  Semiconductor devices
半导体器件
1.
Accelerators simulation experiment on single event effects in semiconductor devices;
半导体器件单粒子效应的加速器模拟实验
2.
In order to improve the forward conduction characteristics of silicon semiconductor devices, a comprehensive study of the influences of boron diffusion, phosphorous diffusion, doping concentration distribution in P~+-P region of sintered Al-Mo electrode and the minority carrier life on the forward conduction characteristics is performed.
为提高硅半导体器件的正向导电特性,文中对器件浓硼扩散、磷扩散和烧结铝电极后P~+-P区掺杂浓度分布、少子寿命等因素的影响进行了实验研究。
3.
They have extensive application prospect in fields such as high brightness light emitting diodes,short wavelength laser diodes,high performance UV detector,and high temperature,high frequency,large power semiconductor devices.
GaN具有禁带宽度大、热导率高、电子饱和漂移速度大和介电常数小等特点,在高亮度发光二极管、短波长激光二极管、高性能紫外探测器和高温、高频、大功率半导体器件等领域有着广泛的应用前景。
4)  semiconductor device
半导体器件
1.
Simulation & Analysis of a Hydrodynamic Model of Semiconductor Devices by a Finite Element Method;
半导体器件动力模型的有限元法仿真与分析
2.
Research for incompetent sources of semiconductor devices which are not up to the standard in DPA;
半导体器件DPA不合格的根源研究
3.
A Galerkin-MMOCAA scheme for a semiconductor device simulation behavior of a semiconductor device;
一类半导体器件模拟的Galerkin-MMOCAA方法
5)  PEM
塑封器件
1.
The Failure of PEM Caused by the Mismatch of CTE;
热膨胀系数不匹配导致的塑封器件失效
2.
PEMs are reputed to offer significant cost,availability,size and weight advantages,but someone still focuses on reliability issues.
但是还是有相当一部分人对于塑封器件的可靠性持怀疑态度。
3.
Based on this, high accelerate stress test (HAST) were done to evaluate the reliability of PEM devices, the proposal from Goddard center of NASA which screen the high reliability PEM devices were introduced.
针对影响塑封器件可靠性的五种失效机理,即腐蚀失效、爆米花效应、低温/温冲失效、闩锁以及工艺缺陷等方面进行分析和讨论,并提出利用高温潮热和温度冲击试验对塑封器件的可靠性进行评估。
6)  plastic encapsulated microcircuits (PEM)
塑封器件
1.
With the persistent improvements in quality and reliability, the application of plastic encapsulated microcircuits (PEM) became more widespread, even including the military field.
随着塑封器件(PEMs)质量和可靠性的不断提高,塑封器件的应用领域进一步扩展,也逐步应用于军事领域。
补充资料:半导体导电性(见半导体的导电与电荷输运)


半导体导电性(见半导体的导电与电荷输运)
electrical conductivity of semiconductor

  半导体导电性eleetr、ea一conou以,v:‘,_‘ 一J一“。,瓜米早伙鼓幕由乌教着给话_
  
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