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1)  SnAgCu solder
SnAgCu焊料
1.
Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate
微量Ce对SnAgCu焊料与铜基界面IMC的影响
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2)  SnAgCu solder joints
SnAgCu焊点
1.
The dissertation performs systemic study on the electronic test methods about evaluating SnAgCu solder joints reliability in the circumstance of thermal load and analyze the feasibility with an in-situ micro electronic-resistance measurement, including integrated analysis of the damag.
本文采用微电阻测量的手段,研究在热载荷条件下SnAgCu焊点可靠性评估的电测方法,并进行可行性分析。
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3)  SnAgCu solder
SnAgCu钎料
1.
In situ observation and research on electrochemical migration of SnAgCu solder joints;
SnAgCu钎料焊点电化学迁移的原位观察和研究
2.
Effect of rare earths elements on properties of SnAgCu solder alloy
稀土元素对SnAgCu钎料性能的影响
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4)  SnAgCu lead-free solder
SnAgCu无铅钎料
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5)  Lead-free material (SnAgCu)
无铅材料(SnAgCu)
6)  SnAgCu solder alloy
SnAgCu钎料合金
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补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8

性质：暂无

制备方法：暂无

用途：用于轻、中度原发性高血压。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。
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