1.
Effect of reflow soldering on IMC and shear strength of SnAgCu solder joint
回流焊对SnAgCu焊点IMC及剪切强度的影响
2.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
3.
The Effect of RE Content on Creep and Aging Properties of Low Ag Content SnAgCu Solder Joints;
RE对低银SnAgCu焊点蠕变及时效特性的影响
4.
Effects of isothermal aging and joint size on the strength of Sn-3.0Ag-0.5Cu microscale solder joints
热时效和焊点尺寸对SnAgCu微焊点强度的影响
5.
DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE
无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测
6.
Research on the Way to Improve the Solderability of SnAgCu Solder and Reliability of Soldered Joints;
提高SnAgCu无铅钎料润湿性及焊点可靠性途径的研究
7.
Research on Effects of Minute Amount of Rare-earth Element Ce on Properties of SnAgCu Alloy and Reliability of Soldered Joints;
微量稀土Ce对SnAgCu钎料合金性能的影响及焊点可靠性的研究
8.
Study of active substance for SnAgCu lead-free solder paste
SnAgCu无铅焊膏用活性物质研究
9.
Effects of Rosin Resin on Properties of SnAgCu Solder Paste
松香树脂对SnAgCu焊膏性能的影响
10.
Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate
微量Ce对SnAgCu焊料与铜基界面IMC的影响
11.
Morphology of Lead-free SnAgCu Solder Wetting on Cu with Artifical Non-wetting Zone;
微结构铜基底上无铅SnAgCu焊料润湿的形貌研究
12.
The Study on Reactive Wettability of SnAgCu Solder Alloy on Au/NiFe/Cu PAD
SnAgCu钎料合金在Au/NiFe/Cu焊盘上的反应润湿研究
13.
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
14.
Study on Soldering Procedure and Joint Properties of Down Quenching SnAgCu Solder Alloy
急冷型SnAgCu系钎料合金钎焊工艺及接头性能研究
15.
Effect of soldering parameters on the soldered joint microstructure performance of the down quenching SnAgCu solder alloy
工艺参数对急冷型SnAgCu系钎料合金钎焊接头组织性能的影响
16.
electrode ,metal contact, for welding machines
电焊机金属接点焊条
17.
Study of Flux for Microelectronics Soldering and Microstructure of Solder Joint;
微电子焊接助焊剂及其焊点组织研究
18.
The joint formed by welding.
焊接点通过焊接形成的接合点