1) ceramic chip-scale package
陶瓷CSP封装
2) ceramic package
陶瓷封装
1.
Using Ni-Co alloy to substitute Ni as the sublayer of gold plating for ceramic package is an important way to improve its resistance to high-temperature.
为了使用Ni Co合金代替Ni作为陶瓷封装电镀金层的底镀层以提高它的抗高温老化能力 ,系统地研究了从氨基磺酸盐镀液中获得低Co含量Ni Co合金镀层的规律 。
2.
Surface analysis of cavity for ceramic packages from main process steps is carriedout with SEM and EDX.
采用SEM和EDX对主要的陶瓷封装外壳生产工艺阶段的芯腔表面进行了形貌观察和成分分析。
3.
The temperatures on the cover edges near the solder-loop and at the bottom of the ceramic package were about 320 ℃ and 100 ℃,respectively.
采用红外热像仪、氦质谱检测仪、六轴测试仪和三维显微镜,分别对陶瓷封装过程中的局部温度变化、温度分布、气密性、封装强度和封装断面进行了检测和分析。
3) ceramic packaging
陶瓷封装
1.
Reducing the stress act on LiNbO_3 chip adopting fall temperature grads and intermingle crystal SiO_2 in epoxy resin,solved the difficulty of LiNbO_3 chip s crazing,LiNbO_3 SAW SMD full ceramic packaging has came true.
文章对铌酸锂声表面波SMD的全陶瓷封装中存在的技术难点及解决方法进行了浅析。
4) full ceramic device
全陶瓷封装
5) CSP package
CSP封装
1.
Solder joint fatigue life predictions for CSP package under power cycling;
功率循环下CSP封装结构焊点的寿命预测分析
6) metal-ceramic package
金属-陶瓷封装
补充资料：电解质陶瓷(见快离子导体陶瓷)
电解质陶瓷(见快离子导体陶瓷)
electrolyte ceramics
电解质陶瓷electrolyte陶瓷。Cera』n1CS即快离子导体
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条