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1)  Ceramic encapsulation capacitor
陶瓷封装电容器
2)  ceramic capacitor
陶瓷电容器
1.
Densification process of Ni electrodes in ceramic capacitors;
陶瓷电容器镍电极的致密化过程
2.
Design of a novel capacitor: multifiber ceramic capacitor;
新型多纤维陶瓷电容器的设计
3.
An experimental investigation was undertaken to study the glass composition and content effects on the adhesion,square resistance and weldability of Ni electrodes in ceramic capacitors.
研究了玻璃粘结剂组成和含量对陶瓷电容器镍电极附着力、方阻和可焊性的影响,并使用SEM和EDS分析了其中的影响机制。
3)  capacitor ceramics
电容器陶瓷
1.
8) on the dielectric properties of(Ba,Sr)TiO_3(Barium Strontium Titanate,BST) ferroelectric capacitor ceramics were investigated.
8]不同对(Ba,Sr)TiO3(Barium strontiumtitanate,BST)铁电电容器陶瓷介电性能的影响,得到不同Nb2O5/Co2O3加入量与BST陶瓷性能的关系。
2.
3TiO(3BST)capacitor ceramics were studied, and mechanism for modifying the properties and microstructure of the BST ceramics by doping of MgO was investigated.
3TiO3基电容器陶瓷。
3.
The influence of doping amount of Bi4Ti3O12 (more than 8%, mass fraction) on the properties of (Ba,Sr)TiO3(barium strontium titanate,BST) series ferroelectric capacitor ceramics were investigated, and the relationship between the additive amount of Bi4Ti3O12 and the properties of BST were obtained.
研究了Bi4Ti3O12掺杂量(≥8%,质量分数)对(Ba,Sr)TiO3(Barium Strontium Titanate,BST)铁电电容器陶瓷介电性能的影响,得到不同Bi4Ti3O12掺杂量与BST陶瓷性能的关系,得到中温烧结(≤1150℃)、高压(≥6。
4)  ceramic capacitors
陶瓷电容器
1.
The research situation and development of medium/high voltage ceramic capacitors were reviewed in this paper.
阐述了中高压陶瓷电容器研究状况及发展。
2.
The properties of phenolic resin coating materials for coating ceramic capacitors made by Namics (Namics Corporation, Japan) and by Sansen (Sansen electrification Co.
对比分析研究了日本纳美仕公司(Namics corporation, Japan)产的陶瓷电容器酚醛树脂包封料与中国江苏镇江三森电气有限公司(简称中国三森公司)产的陶瓷电容器酚醛树脂包封料的性能,利用SEM和XRD研究了这两种包封料的无机填料的形貌及其颗粒大小和物相组成,找到了日本纳美仕公司产的酚醛树脂包封料和中国三森公司产的酚醛树脂包封料性能不同的根本所在。
3.
The influence of the composition of the epoxy-phenolic resin for coating ceramic capacitors on its properties has been investigated by means of single factor various method, and the law governing the influence has been obtained.
采用单因素变量法研究了组成对陶瓷电容器用环氧-酚醛树脂包封料性能的影响,得到了综合性能好的包封料,这种包封料干燥时间为8 h(低于20℃条件下),耐溶剂性时间为70 h(丙酮中36~38℃)。
5)  Package ceramic
包装容器陶瓷
6)  ceramic package
陶瓷封装
1.
Using Ni-Co alloy to substitute Ni as the sublayer of gold plating for ceramic package is an important way to improve its resistance to high-temperature.
为了使用Ni Co合金代替Ni作为陶瓷封装电镀金层的底镀层以提高它的抗高温老化能力 ,系统地研究了从氨基磺酸盐镀液中获得低Co含量Ni Co合金镀层的规律 。
2.
Surface analysis of cavity for ceramic packages from main process steps is carriedout with SEM and EDX.
采用SEM和EDX对主要的陶瓷封装外壳生产工艺阶段的芯腔表面进行了形貌观察和成分分析。
3.
The temperatures on the cover edges near the solder-loop and at the bottom of the ceramic package were about 320 ℃ and 100 ℃,respectively.
采用红外热像仪、氦质谱检测仪、六轴测试仪和三维显微镜,分别对陶瓷封装过程中的局部温度变化、温度分布、气密性、封装强度和封装断面进行了检测和分析。
补充资料:电容器陶瓷
分子式:
CAS号:

性质:电容器陶瓷介质材料的总称。按其温度特性可分为温度补偿型,温度稳定型和温度非线性型。按主晶相是否具有铁电性可分为铁电和非铁电两类。按介电常数数值可分为低介和高介陶瓷。中国国家标准分为三类:I型,具有介电常数比结构陶瓷高(约12~900),介电常数、温度系数范围宽,介质损耗角正切值小,性能稳定等特性,如金红石瓷,钛酸钙瓷,镁镧钛瓷,锆酸盐瓷等;Ⅱ型,其介电常数比I型高,介电常数随温度和电场变化呈非线性变化,且具有电滞回线等,如钛酸钡基铁电陶瓷;III型,具有晶粒半导化、晶界绝缘层、高介电常数、低介电常数温度系数的特性,如钛酸钡基,钛酸锶基半导体陶瓷。电容器陶瓷品种繁多,性能各异,在电子电路中应用十分广泛。

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