1.
The generator represents magnetron, packaged with constant magnets in ceramic-metal execution.
该磁控管采用金属陶瓷封装，装有永磁体。
2.
Impact of Hot-Cutting Defect on Reliability of Ceramic Packaging and a Novel Concept of Structure Design;
热切缺陷对陶瓷封装可靠性的影响和一种结构设计新概念
3.
An Expression for the Property Degradation of the Ceramic Encapsulation Capacitor under Thermal Cycling and Co-60γ Radiation;
热循环及Co-60γ辐照环境下陶瓷封装电容器的性能退化
4.
ceramic dual in-line package
陶瓷双列直插式封装
5.
Study on Antibullet Performance of Metal-ceramic Composite Armor
金属封装陶瓷复合装甲抗弹性能研究
6.
Packages canbe plastic, ceramic, Cer-DIP, or other type.
封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。
7.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
8.
The generator represents magnetron, packaged with constants and electromagnets(2 coils magnetic) in the magnetic-shielded ceramic-metal execution.
该磁控管的设计采用电磁石，封装采用金属陶瓷。
9.
paste-on-paste pate-surpate
(陶瓷装饰) (法) 堆花
10.
gable-end ornament, ceramic
山墙部装饰物,陶瓷的
11.
which is in a ceramic teapot.
这些茶装在陶瓷茶壶中。
12.
ON CERAMIC SCULPTURE AND INSTALLATION OF ENVIRONMENTAL CERAMIC ART
论环境陶艺中的陶瓷雕塑与装置艺术
13.
The Second Metallizing Process of Ceramic to Metal Seal
陶瓷-金属封接中的二次金属化工艺
14.
Active Alloy Brazing Al_2O_3 Ceraics and Metal;
氧化铝陶瓷与金属活性封接技术研究
15.
The Study of SiO_2-Al_2O_3 Sol Sealing Reagent for Ceramic Coatings
陶瓷涂层SiO_2-Al_2O_3溶胶封孔剂的制备研究
16.
Active Brazing AlN Ceramic and Mo-Cu Alloy Using Ag-Cu-Ti
Ag-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金
17.
Comparison of residual stress formed in tubular ceramics/metal jointing process
管状陶瓷金属封接残余应力计算比较
18.
Seal Structure and Technique of Broad Band High Power Rectangular Ceramic Hermetic Windows
宽带高功率矩形陶瓷密封窗封接结构及工艺