1.
Power Cycling Simulation and Solder Joint Life Prediction for Chip Scale Package;
CSP封装功率循环模拟及焊点的寿命预测分析
2.
Stress Finite Element Analysis and Structure Optimization in a Stacked Chip Size Package;
叠层CSP封装结构应力有限元分析及结构优化
3.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
4.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
5.
A Study on Thermal Stress and Invalidation for Chip Scale Package;
芯片尺寸封装（CSP）的热应力及热失效分析研究
6.
Research on Component Composition Based on CSP Formal Semantic;
基于CSP形式语义的构件组装研究
7.
The Research of Synthesis and Packing Column about the Second-generation Brush-type CSP;
第二代刷型手性固定相DNB-Leucine CSP合成及柱填装的研究
8.
sealing device [ballot box]
封箱装置〔投票箱〕
9.
Front Oil Seal Installer 6635
前油封安装器6635
10.
Design of GFP Encapsulation and De-encapsulation Module in EoS
EoS中GFP封装与解封装模块的设计
11.
Design of GFP encapsulation and de-encapsulation in EoS system
EoS系统中GFP封装与解封装的设计
12.
The letter was contained in a bottle fast as a Kentish oyster.
那封信装在一只高度密封的瓶子里。
13.
cask-filling, closing, sealing or labeling cachine
用于桶装填、封口、密封或贴标签的机器
14.
the seal of the air-balancing cylinder adopts multi-stage seal;
气平衡缸密封部位采用多级密封装置 ;
15.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
16.
epoxy seal transistor
环氧树脂封装晶体管
17.
Fold the letter before putting it in the envelope.
把信摺起来再装入信封.
18.
phonograph records were sold in cardboard jackets.
唱片装在封套里出售。