1) wafer bumping
晶圆凸点
2) wafer
晶圆
1.
Evolution of Wafer-Surface Preparation for Semiconductor Industry;
半导体产业中晶圆片表面处理的发展
2.
The structural design of the wafer expansion device was put forward.
该装置可完成片盒、内圈和外圈的输入和取片动作,实现扩晶过程张紧力的调节控制、分离晶圆和衬架、排出空片盒和废弃的衬架等。
3.
We present a FEM method for forecasting the suitable pressure on the retaining ring,which is critical in manufacturing good quality wafers.
随着晶圆直径的增加,在CMP加工过程中,晶圆边缘容易出现"过磨(over-grinding)"现象,降低了平坦度和晶圆利用率。
3) Wafer bumping
晶圆凸起
4) 300mm wafer line
300mm晶圆线
5) wafer fabrication
晶圆加工
1.
According to the characteristics,the modeling problem using Petri net for cluster tools in wafer fabrication was studied.
晶圆加工过程中使用的模块化组合设备具有可重构性,设备配置的复杂程度由晶圆加工工艺方案决定,针对这一特点,研究了晶圆加工系统的Petri网建模问题。
6) (111)silicon
（111）硅晶圆
参考词条
补充资料：凸凸
1.高出貌。
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