1) non-CMP planarization
非CMP平坦化
1.
7nm N/O stack gate dielectric,non-CMP planarization technology,a T-type refractory W/TiN metal stack gate electrode,and a novel super steep retrograde channel doping using he.
为抑制短沟道效应并提高器件驱动能力,采用的关键技术主要包括:1·7nm N/O叠层栅介质,非CMP平坦化技术,T型难熔W/Ti N金属叠层栅电极,新型重离子超陡倒掺杂沟道剖面技术以及双侧墙技术。
3) chemical mechanical planarization(CMP)
化学机械平面抛光(CMP)
4) planarization
平坦化
1.
Performance and analysis of the planarization technologyin IC manufacture;
IC制造中平坦化技术的性能与分析
2.
A Planarization Technique for Fully Dielectrically Isolated SOI IC s;
一种适合SOI全介质隔离电路的平坦化技术
3.
Polyimide passivation and planarization process techniques for high speed InP/InGaAs single heterojunction bipolar transistors(SHBTS)are developed.
成功地将Polyimide钝化平坦化工艺应用于InP/InGaAs单异质结晶体管制作工艺中。
5) flatness
[英]['flætnis] [美]['flætnɪs]
平坦化
1.
In the experiment,aiming at the silicon wafer CMP flatness,some investigations on the effects of the pressure,rotation,polishing pad,slurry on the CMP were carried out.
针对硅晶圆CMP平坦性问题,系统地考察了压力、转速、抛光垫、浆料、温度等因素对硅晶圆平坦化速率的影响,从中找到它们之间的优化参数,减少CMP工艺中的表面划伤、抛光雾、金属离子沾污,清除残余颗粒,保证硅晶圆的平坦化质量。
2.
In preparation for the challenges of "flatness",governments must create a market environment with sound and rational rules of the game.
全球化时代,世界出现“平坦化”趋势。
3.
In the experiment,aiming at the silicon wafer CMP flatness,some investigations on the effects of the pressure,rotation,polishing pad,slurry on the CMP were carried out.
针对硅晶圆 CMP 平坦性问题,系统地考察了压力、转速、抛光垫、浆料、温度等因素对硅晶圆平坦化速率的影响,从中找到它们之间的优化参数,减少 CMP 工艺中的表面划伤、抛光雾、金属粒子沾污,清除残余颗粒,保证硅晶圆的平坦化质量。
6) plateau curing
平坦硫化
补充资料：非应非化
【非应非化】
谓佛法、报二身，非属应、化，是名非应非化。
谓佛法、报二身，非属应、化，是名非应非化。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条