1) gradually flattening
分级平坦化
1.
A new theory of gradually flattening gray spectrum was presented to overcome the contrast resolution limitation of human vision.
本文提出了一种新的理论-灰度谱分级平坦化来克服人类视觉对比度分辨率限制。
2) gradually flatting the gray/chroma spectrum
灰度/色度谱分级平坦化
3) Differential flatness
微分平坦
1.
This paper introduces the main character of the Wheeled Mobile Robot, the nonholonomic constraint and differential flatness firstly; secondly, discuss the kinematics model and the dynamic model of WMR; after that, gives the one-time trajectory planning method in the based on the static environment based on the differential flatness.
基本思想是首先利用微分平坦的性质研究基于轮式移动机器人动力学模型的一次轨迹规划方法,在此基础上融合了滚动优化思想并研究了其在广义控制问题中的应用,研究了基于滚动优化思想的滚动轨迹规划与生成问题,把一次规划方法扩展成为滚动轨迹规划方法。
4) planarization
平坦化
1.
Performance and analysis of the planarization technologyin IC manufacture;
IC制造中平坦化技术的性能与分析
2.
A Planarization Technique for Fully Dielectrically Isolated SOI IC s;
一种适合SOI全介质隔离电路的平坦化技术
3.
Polyimide passivation and planarization process techniques for high speed InP/InGaAs single heterojunction bipolar transistors(SHBTS)are developed.
成功地将Polyimide钝化平坦化工艺应用于InP/InGaAs单异质结晶体管制作工艺中。
5) flatness
[英]['flætnis] [美]['flætnɪs]
平坦化
1.
In the experiment,aiming at the silicon wafer CMP flatness,some investigations on the effects of the pressure,rotation,polishing pad,slurry on the CMP were carried out.
针对硅晶圆CMP平坦性问题,系统地考察了压力、转速、抛光垫、浆料、温度等因素对硅晶圆平坦化速率的影响,从中找到它们之间的优化参数,减少CMP工艺中的表面划伤、抛光雾、金属离子沾污,清除残余颗粒,保证硅晶圆的平坦化质量。
2.
In preparation for the challenges of "flatness",governments must create a market environment with sound and rational rules of the game.
全球化时代,世界出现“平坦化”趋势。
3.
In the experiment,aiming at the silicon wafer CMP flatness,some investigations on the effects of the pressure,rotation,polishing pad,slurry on the CMP were carried out.
针对硅晶圆 CMP 平坦性问题,系统地考察了压力、转速、抛光垫、浆料、温度等因素对硅晶圆平坦化速率的影响,从中找到它们之间的优化参数,减少 CMP 工艺中的表面划伤、抛光雾、金属粒子沾污,清除残余颗粒,保证硅晶圆的平坦化质量。
6) plateau curing
平坦硫化
补充资料：公理化方法(见公理化和形式化)
公理化方法(见公理化和形式化)
axiomatical method
gongllbuafangfa公理化方法化和形式化。(axiomatieal method)见公理
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条