2) semiconductor device
半导体设备
1.
The transient behavior of a semiconductor device of heat conduction is considered.
考虑热引导半导体设备中的传输行为 。
3) semiconductor equipment
半导体设备
1.
Application of GEM in semiconductor equipment;
半导体设备通讯标准GEM的应用
2.
Watch Dog of SCM System in Semiconductor Equipment;
应用于半导体设备的单片机系统中的“看门狗”
3.
The world semiconductor equipment market in the year 1999～2000, consist of the equipment investment, the photolithography equipment and the wiring shaping equipment are introduced.
介绍了１９９９ ～２０００ 年世界半导体设备市场，包括设备投资、光刻机和布线形成设备。
4) semiconductor test
半导体测试
1.
Compiling VCD to ATE recognized Patterns is an essential work to develop semiconductor test program.
在半导体测试程序开发中如何快速有效地进行VCD-模式的编译是一项重要的课题。
2.
Most semiconductor test problems are multiple resources constrained unrelated parallel machine scheduling problems with consideration of sequence-dependant setup times.
半导体测试是资金高度密集、涉及产品种类与设备种类繁多的半导体生产环节。
3.
Experiments show that Sarsa(λ,k)outperforms the scheduling method in industry and validate its effectiveness to solve the semiconductor test scheduling problem.
采用Sarsa(λ,k)学习算法求解、产品、测试机、测试工具包、使能器部件对应关系非常复杂的半导体测试调度问题。
5) semiconductor packaging equipment
半导体封装设备
1.
The Research of Data Communication in Semiconductor Packaging Equipment Based on TCP/IP;
基于TCP/IP的半导体封装设备之间数据通信的研究
2.
A general investigation on the application of the TCP/IP on semiconductor packaging equipment was introduced,based on it the issues of the TCP/IP protocol for network communication of semiconductor packaging equipments was solved.
介绍了利用WinSock进行网络编程的一般方法,并在此基础上解决了半导体封装设备使用TCP/IP协议进行网络实时通信的问题,实现了在服务器和客户机两端准确方便地实时发收文件和互相通信,并测试了发收不同大小文件所消耗的平均时间。
3.
Presenting a solution based on SECS standard interface,and the issues of the semiconductor packaging equipment communication was solved.
介绍了SECS标准的构成,提出了使用SECS标准接口解决半导体封装设备通信的问题,使所有设备全部都通过使用SECS标准接口连接到单元控制器及更高级别的MES和工厂计划信息系统。
补充资料：半导体导电性(见半导体的导电与电荷输运)
半导体导电性(见半导体的导电与电荷输运)
electrical conductivity of semiconductor
半导体导电性eleetr、ea一conou以，v:‘，_‘ 一J一“。，瓜米早伙鼓幕由乌教着给话_
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条