1.
The Research of Data Communication in Semiconductor Packaging Equipment Based on TCP/IP;
基于TCP/IP的半导体封装设备之间数据通信的研究
2.
Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging
非制冷980nm半导体激光器封装设计与热特性分析
3.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
4.
New Development about Industry for IC Package Substrate in Taiwan;
发展中的台湾半导体封装用载板产业
5.
system for heat treatment of semi-conductors
半导体瞬态热处理设备
6.
Approximate Dynamic Job-shop Scheduling Optimization for Semiconductor Assembly Based on Swarm Intelligence
半导体封装作业调度的群体智能近似动态优化
7.
Research on Modeling, Control and Implementation of Dispensing System for IC Packaging;
面向半导体封装的点胶系统建模、控制与实现
8.
Study on the Dissipation and Packaging of High Power Laser Diode Module;
大功率半导体激光模块的散热与封装研究
9.
The Implementation of SOP16 Product Cost Control in the FC Semiconductor Manufacturing Process;
FC半导体封装工厂SOP16的制造成本控制研究
10.
A Study on the Measurement System Analysis in Photoelectronl Semiconductor Assembly;
光电半导体封装测量系统能力分析方法研究
11.
Power Semiconductor Devise and Packaging Advances Target Automotive Applications
面向汽车应用的功率半导体器件与封装
12.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
13.
The Researching of Algorithm for Bay-Layout in Semiconductor’s Assembly and Test Department
半导体封装测试车间隔间布局算法研究
14.
Quality Controlling of Semiconductor Assembly Based on Principal Components Analysis
基于主成分分析的半导体封装质量控制系统
15.
A Global Expenditure on Semiconductor Capital and Semiconductor Equipment Market in the Year 2005/2006;
2005／2006年全球半导体资本支出与半导体设备市场
16.
Design of Automatic Quantitative Glue Dispenser for Semiconductor Surge Arrester
半导体放电管定量自动注胶装置设计
17.
Sound knowledge in semiconductor physics, semiconductor device testing and characterization.
具备半导体物理学,半导体设备测试和性能的相关知识.
18.
Assembly Process and Product Reliability Assurance System In Samsung Suzhou Semiconductor
苏州三星半导体封装工艺及产品可靠性保障体系