1) Semiconductor Assembly and Test
半导体封装测试
1.
The Study of WIP Control System in Semiconductor Assembly and Test Factory;
半导体封装测试厂库存控制系统的研究
2) semiconductor packaging
半导体封装
1.
Time-pressure dispensing technology is widely used in semiconductor packaging.
时间/压力型流体点胶技术在半导体封装过程中有着广泛的应用。
2.
The snap curing oven is key equipment in the semiconductor packaging.
半导体封装快速养护炉是半导体封装过程中的一个关键设备。
3.
It is hard to acquire test data form variant type of semiconductor packaging test machine,because the data format of variant machine is different.
针对半导体封装测试机机型多、数据文件格式不统一、数据获取难的问题,提出了一种基于虚拟机的数据获取接口技术。
4) semi-product backend
半导体封测
1.
How to apply advanced management mode and methods base on ERP to semi-product backend enterprise,will be very important to semi-product backend enterprise’s management.
如何将ERP中先进的管理模式和方法应用到半导体封测类企业中去,对现代半导体封测类企业将有非常重要的意义。
5) semiconductor test
半导体测试
1.
Compiling VCD to ATE recognized Patterns is an essential work to develop semiconductor test program.
在半导体测试程序开发中如何快速有效地进行VCD-模式的编译是一项重要的课题。
2.
Most semiconductor test problems are multiple resources constrained unrelated parallel machine scheduling problems with consideration of sequence-dependant setup times.
半导体测试是资金高度密集、涉及产品种类与设备种类繁多的半导体生产环节。
3.
Experiments show that Sarsa(λ,k)outperforms the scheduling method in industry and validate its effectiveness to solve the semiconductor test scheduling problem.
采用Sarsa(λ,k)学习算法求解、产品、测试机、测试工具包、使能器部件对应关系非常复杂的半导体测试调度问题。
6) package test
封装测试，封装体测试
补充资料：半导体导电性(见半导体的导电与电荷输运)
半导体导电性(见半导体的导电与电荷输运)
electrical conductivity of semiconductor
半导体导电性eleetr、ea一conou以，v:‘，_‘ 一J一“。，瓜米早伙鼓幕由乌教着给话_
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条