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1)  polished wafer
抛光片
1.
Through researching the clean process of Ge polished wafers,the surface quality was improved effectively.
通过对Ge单晶抛光片清洗技术进行研究,有效提高了Ge抛光片的表面质量,降低了Ge抛光片的表面颗粒度,控制了Ge抛光片的氧化层深度。
2.
During the process of the VB(vertical Bridgman) GaAs ingots,the procedures(including the slicing process,lapping process,chemical etch process and polishing process)have different influences on the geometry parameters of the VB-GaAs polished wafers.
在VB(垂直布里奇曼法)GaAs材料加工过程中,切割、研磨、化学腐蚀、抛光等工序对VB GaAs抛光片的几何参数有着不同程度的影响。
2)  silicon wafer polishing
硅片抛光
3)  polished silicon wafer
抛光硅片
1.
In this work, the iron contamination on the polished silicon wafers fabricated by different procedures has been probed by SPV, and then the dominant iron contamination sources during the fabrication process have been found.
本文通过SPV法测试不同流程制造的P型抛光硅片中的铁沾污 ,找到了在P型抛光硅片制造工艺过程中引入铁沾污的主要来源。
4)  Polished GaAs Wafers
GaAs抛光片
1.
Primary Study of Etching Process for Polished GaAs Wafers;
GaAs抛光片腐蚀过程初步研究
5)  Polishing Substrate
抛光基片
1.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
6)  polished section
抛光磨片
补充资料:抛光剂,抛光混合剂
CAS:68909-13-7
中文名称:焙烧提浓的氟碳铈镧矿;抛光剂,抛光混合剂
英文名称:Bastnaesite, calcined concentrate;Calcined bastnasite;bastnaesite, calcined conc.;polishing compound;Bastnaesite,calcined concentrate
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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