1.
Effect of Polishing Processes on the Roughness of GaAs Wafers
抛光工艺对GaAs抛光片粗糙度的影响
2.
Research on Cleaning Process of GaAs Polished Wafer for LED
LED用GaAs抛光片清洗技术研究
3.
Research of Polished Technology of VB GaAs Wafers
VB-GaAs单晶片抛光技术研究
4.
Synthesis of CeO_2 Nanoparticles via Alcohol-water Method and Its Polishing Performance on GaAs Wafer;
纳米CeO_2颗粒的醇水法制备及其对GaAs晶片的抛光性能研究
5.
Experimental Study on Parameter Optimization of GaAs Wafer Polishing Using Taguchi Method
基于田口方法的GaAs基片化学机械抛光加工工艺研究
6.
Research on the Polishing of Silicon Wafer by Fixed Abrasive Pad
固结磨料抛光垫抛光硅片的探索研究
7.
A 5Gb/s GaAs MSM/PHEMT Monolithic Optoelectronic Integrated Circuit (OEIC) Receiver Front End;
5Gb/s GaAs MSM/PHEMT单片光电子集成（OEIC）接收机前端
8.
Study of Monolithic Integrated GaAs-Based Long Wavelength Resonant Cavity Enhanced Photodetector
单片集成GaAs基长波长谐振腔光探测器的研究
9.
GaAs based InP/InGaAs HBT for monolithic integrated optical receiver application
用于单片集成光接收机前端的GaAs基InP/InGaAs HBT
10.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
11.
Swirl marks are removed by polishing. Covering one small section at a time allows you to check your progress.
抛光可以祛除涡痕。小片小片的抛光及时检查你的工作。
12.
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
13.
Test methods for surface flatness of silicon polished slices
GB/T6621-1995硅抛光片表面平整度测试方法
14.
Polished monocrystalline sapphire substrates
GB/T13843-1992蓝宝石单晶抛光衬底片
15.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
16.
An Experimental Study of the Polishing Process for MgO Single Crystal Substrate;
单晶MgO基片抛光工艺的实验研究
17.
An Experimental Study of the Polishing Process for CZT Crystal;
碲锌镉晶体基片抛光工艺的实验研究
18.
Study on the Surface-State of GaAs Polished Wafer for the Use of LED
LED用砷化镓抛光片表面状态研究