1.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
2.
An Experimental Study of the Polishing Process for MgO Single Crystal Substrate;
单晶MgO基片抛光工艺的实验研究
3.
An Experimental Study of the Polishing Process for CZT Crystal;
碲锌镉晶体基片抛光工艺的实验研究
4.
Influence of abrasive and chemical composition on chemo-mechanical polishing of MgO single crystal substrate
抛光液中磨料和化学成分对单晶MgO基片化学机械抛光的影响
5.
Effect of Polishing Processes on the Roughness of GaAs Wafers
抛光工艺对GaAs抛光片粗糙度的影响
6.
Research on the Polishing of Silicon Wafer by Fixed Abrasive Pad
固结磨料抛光垫抛光硅片的探索研究
7.
CMP Effect and Super-smooth Surface Acquirement
化学机械抛光作用与单晶基片超光滑表面的获取
8.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
9.
Experimental Study on Parameter Optimization of GaAs Wafer Polishing Using Taguchi Method
基于田口方法的GaAs基片化学机械抛光加工工艺研究
10.
Basic Research on Hybrid Technology of Ultrasonic Elliptic Vibration Assisted Chemical-Mechanical Polishing a Silicon Wafer;
超声椭圆振动—化学机械复合抛光硅片技术的基础研究
11.
A Study on a Polishing Process of Cr12 Hardening Steel with the Embedded Combined Tools
基于嵌片式复合工具的电解-机械抛光Cr12淬火钢实验研究
12.
Characteristic of Material Removal in Chemical Mechanical Polishing of Silicon Wafer Based on Abrasion Behavior
基于磨损行为的单晶硅片化学机械抛光材料的去除特性
13.
Analysis on temperature field when polishing with ice fixed abrasives based on FEM
基于有限元法的硅片冰冻固结磨料抛光温度场分析
14.
On the Strengthening and Polishing Process of Aerocraft Engine Blades and Its Test Study
基于三维振动的飞机发动机叶片强化抛光工艺及试验研究
15.
Swirl marks are removed by polishing. Covering one small section at a time allows you to check your progress.
抛光可以祛除涡痕。小片小片的抛光及时检查你的工作。
16.
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
17.
Test methods for surface flatness of silicon polished slices
GB/T6621-1995硅抛光片表面平整度测试方法
18.
Polished monocrystalline sapphire substrates
GB/T13843-1992蓝宝石单晶抛光衬底片