1.
Effect of Polishing Processes on the Roughness of GaAs Wafers
抛光工艺对GaAs抛光片粗糙度的影响
2.
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
3.
Test methods for surface flatness of silicon polished slices
GB/T6621-1995硅抛光片表面平整度测试方法
4.
Study on the Surface-State of GaAs Polished Wafer for the Use of LED
LED用砷化镓抛光片表面状态研究
5.
Research on Cleaning Process of GaAs Polished Wafer for LED
LED用GaAs抛光片清洗技术研究
6.
Study on the "Haze" Problem of Stored Silicon Wafer
Si抛光片存储中表面起“雾”的研究
7.
Test method for the surface quality of polished silicon wafers and epitaxial wafers by optical-reflectio
GB/T17169-1997硅抛光片和外延片表面质量光反射测试方法
8.
Test method for detection of oxidation induced defects in polished silicon wafers
GB/T4058-1995硅抛光片氧化诱生缺陷的检验方法
9.
Standard method for measuring the surface quality of polished silicon slices by visual inspection
GB/T6624-1995硅抛光片表面质量目测检验方法
10.
Progress on Cleaning Technology of Ge Polished Wafers for Solar Cell
太阳电池用Ge抛光片清洗技术的研究进展
11.
Research on the Polishing of Silicon Wafer by Fixed Abrasive Pad
固结磨料抛光垫抛光硅片的探索研究
12.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
13.
Swirl marks are removed by polishing. Covering one small section at a time allows you to check your progress.
抛光可以祛除涡痕。小片小片的抛光及时检查你的工作。
14.
Polished monocrystalline sapphire substrates
GB/T13843-1992蓝宝石单晶抛光衬底片
15.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
16.
An Experimental Study of the Polishing Process for MgO Single Crystal Substrate;
单晶MgO基片抛光工艺的实验研究
17.
An Experimental Study of the Polishing Process for CZT Crystal;
碲锌镉晶体基片抛光工艺的实验研究
18.
Research of Polished Technology of VB GaAs Wafers
VB-GaAs单晶片抛光技术研究