1) semiconductor packaging
半导体封装
1.
Time-pressure dispensing technology is widely used in semiconductor packaging.
时间/压力型流体点胶技术在半导体封装过程中有着广泛的应用。
2.
The snap curing oven is key equipment in the semiconductor packaging.
半导体封装快速养护炉是半导体封装过程中的一个关键设备。
3.
It is hard to acquire test data form variant type of semiconductor packaging test machine,because the data format of variant machine is different.
针对半导体封装测试机机型多、数据文件格式不统一、数据获取难的问题,提出了一种基于虚拟机的数据获取接口技术。
3) photoelectron semiconductor assembly
光电半导体封装
1.
For improving the quality of devide BIN process in photoelectron semiconductor assembly,it is necessary to analyze and study the measurement system.
在深入分析光电半导体封装过程中的测量系统特征的基础上,建立了基于属性GR&R的测量系统能力分析模型和方法,并通过实例进行了验证。
4) semiconductor packaging equipment
半导体封装设备
1.
The Research of Data Communication in Semiconductor Packaging Equipment Based on TCP/IP;
基于TCP/IP的半导体封装设备之间数据通信的研究
2.
A general investigation on the application of the TCP/IP on semiconductor packaging equipment was introduced,based on it the issues of the TCP/IP protocol for network communication of semiconductor packaging equipments was solved.
介绍了利用WinSock进行网络编程的一般方法,并在此基础上解决了半导体封装设备使用TCP/IP协议进行网络实时通信的问题,实现了在服务器和客户机两端准确方便地实时发收文件和互相通信,并测试了发收不同大小文件所消耗的平均时间。
3.
Presenting a solution based on SECS standard interface,and the issues of the semiconductor packaging equipment communication was solved.
介绍了SECS标准的构成,提出了使用SECS标准接口解决半导体封装设备通信的问题,使所有设备全部都通过使用SECS标准接口连接到单元控制器及更高级别的MES和工厂计划信息系统。
5) Semiconductor Assembly and Test
半导体封装测试
1.
The Study of WIP Control System in Semiconductor Assembly and Test Factory;
半导体封装测试厂库存控制系统的研究
补充资料：半导体导电性(见半导体的导电与电荷输运)
半导体导电性(见半导体的导电与电荷输运)
electrical conductivity of semiconductor
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条