1.
The Researching of Algorithm for Bay-Layout in Semiconductor’s Assembly and Test Department
半导体封装测试车间隔间布局算法研究
2.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
3.
Study on Capacity Improvement of Semiconductor Assembly and Test Factory;
半导体集成电路封装测试工厂生产能力提升研究
4.
EM China covers semiconductor manufacturing, packaging, SMT, PCB and related test and measurement equipment and technology.
《电子制造》 重点关注半导体制造与封装、表面贴装技术与印刷线路板及相关的测试与测量技术，
5.
A Study on the Measurement System Analysis in Photoelectronl Semiconductor Assembly;
光电半导体封装测量系统能力分析方法研究
6.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
7.
New Development about Industry for IC Package Substrate in Taiwan;
发展中的台湾半导体封装用载板产业
8.
semiconductor memory test system
半导体存储器测试系统
9.
Research of ERP Cost Accounting in Semi-Product Backend Enterprises;
半导体封测业ERP成本核算问题研究
10.
Approximate Dynamic Job-shop Scheduling Optimization for Semiconductor Assembly Based on Swarm Intelligence
半导体封装作业调度的群体智能近似动态优化
11.
Research on Modeling, Control and Implementation of Dispensing System for IC Packaging;
面向半导体封装的点胶系统建模、控制与实现
12.
Study on the Dissipation and Packaging of High Power Laser Diode Module;
大功率半导体激光模块的散热与封装研究
13.
The Implementation of SOP16 Product Cost Control in the FC Semiconductor Manufacturing Process;
FC半导体封装工厂SOP16的制造成本控制研究
14.
Power Semiconductor Devise and Packaging Advances Target Automotive Applications
面向汽车应用的功率半导体器件与封装
15.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
16.
Quality Controlling of Semiconductor Assembly Based on Principal Components Analysis
基于主成分分析的半导体封装质量控制系统
17.
Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging
非制冷980nm半导体激光器封装设计与热特性分析
18.
galloping 1 and 0
跃步“１”和“０”-半导体存储器的测试法