1.
A kind of particle swarm optimization method with the characteristic of logical time-sequenced is proposed and applied to procedure parameters optimization of semiconductor assembly product line.
提出一种具有逻辑时序特征的微粒群优化算法，并将其应用于半导体封装生产线的工序参数优化中。
2.
New Development about Industry for IC Package Substrate in Taiwan;
发展中的台湾半导体封装用载板产业
3.
Study on Capacity Improvement of Semiconductor Assembly and Test Factory;
半导体集成电路封装测试工厂生产能力提升研究
4.
Research & Realization of Production Management System in a Semiconductor Manufacturing;
半导体封装行业生产管理系统的应用研究与开发
5.
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
6.
Evaluation of Bondability and Reliability of Single Crystal Copper Wire Bonding in Semiconductor Packaging;
单晶铜丝在半导体器件封装中的打线键合性能研究
7.
Assembly Process and Product Reliability Assurance System In Samsung Suzhou Semiconductor
苏州三星半导体封装工艺及产品可靠性保障体系
8.
Research on the Preventive Maintenance Cycle of Semiconductor Production Line;
半导体生产线预防性维修周期的研究
9.
Research of Scheduling Strategies for Batching Tools in Semiconductor Wafer Fabrication;
半导体生产线批处理机调度策略研究
10.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
11.
Semiconductor Production Line Dynamic Scheduling Multi-agent Modeling Research;
半导体生产线调度的多智能体建模方法研究
12.
EM China covers semiconductor manufacturing, packaging, SMT, PCB and related test and measurement equipment and technology.
《电子制造》 重点关注半导体制造与封装、表面贴装技术与印刷线路板及相关的测试与测量技术，
13.
Approximate Dynamic Job-shop Scheduling Optimization for Semiconductor Assembly Based on Swarm Intelligence
半导体封装作业调度的群体智能近似动态优化
14.
Research on Hot Lots Scheduling of Semiconductor Wafer Fab;
半导体生产线的紧急订单调度问题研究
15.
Research on scheduling approach for semiconductor wafer fabrication based on ant colony algorithms
基于蚁群算法的半导体生产线调度方法研究
16.
Research on Modeling, Control and Implementation of Dispensing System for IC Packaging;
面向半导体封装的点胶系统建模、控制与实现
17.
Study on the Dissipation and Packaging of High Power Laser Diode Module;
大功率半导体激光模块的散热与封装研究
18.
The Implementation of SOP16 Product Cost Control in the FC Semiconductor Manufacturing Process;
FC半导体封装工厂SOP16的制造成本控制研究