1) Sn-9Zn eutectic solder
Sn-9Zn共晶钎料
1.
The element of In was added to improve the soderability of Sn-9Zn eutectic solder.
Sn-9Zn共晶钎料可以用于钎焊钎焊性极差的铸造铝合金ZL102,在Sn-9Zn钎料的基础上添加In元素,以提高钎料对ZL102合金的润湿。
3) Sn-9Zn solder
Sn-9Zn焊料
1.
The flux from lactic acid、polyethylene glycol and SnCl2 is good suitable for the Sn-9Zn solder.
通过测量润湿面积和润湿角,研究不同助焊剂对Sn-9Zn焊料润湿性的影响。
2.
And the wettability of Sn-9Zn solder was investigated.
为解决无铅焊料润湿性差的问题,采用卤化物活性剂松香焊剂,通过实验研究了Sn-9Zn焊料的润湿性。
4) eutectic solder
共晶钎料
1.
Shear strength of BGA packaging device joints with Sn-Pb eutectic solder were studied in the paper using Micro-joints Strength Tester,and compared BGA joints shear strength with different diameters.
采用微焊点强度测试仪研究了Sn-Pb共晶钎料BGA(球栅阵列封装技术)封装器件焊点的抗剪强度,并对不同直径的BGA球焊点的抗剪强度进行了比较。
2.
The tensile strength of soldered joints of QFP with pure lead is higher than that of eutectic solder and as well and as higher .
研究结果表明,在相同的钎料成分下,焊脚间距越大,所需的抗拉力越大,抗拉强度越高;共晶钎料QFP焊点的抗拉强度比纯铅的抗拉强度低,QFP焊点的结合强度比钎料自身的抗拉强度高。
5) SnPb eutectic solder
SnPb共晶钎料
1.
Reaction kinetics between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow;
激光加热条件下SnPb共晶钎料与Au/Ni/Cu焊盘界面反应动力学
2.
SnPb eutectic solder reflow on BGA pad metallized with Au/Ni to form solder bump with induction self excite heat under alternate electromagnetic radiation is performed, and impacts of induction self excite heat and solid state aging on interfacial reaction between SnPb eutectic solder and Au/Ni metallization are investigated.
进行了交变电磁辐射下附Au/Ni镀层BGA焊盘上SnPb共晶钎料球感应自发热重熔形成钎料凸台的实验,并分析了感应自发热重熔以及固态老化对SnPb共晶钎料与Au/Ni镀层焊盘界面反应的影响。
6) eutectic SnBi solder
共晶SnBi钎料
补充资料：钎料
分子式：
CAS号：
性质：为实现两种材料（或零件）的结合，在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料（熔点低于450℃的钎料），硬钎料（熔点高于450℃的钎料）。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。
CAS号：
性质：为实现两种材料（或零件）的结合，在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料（熔点低于450℃的钎料），硬钎料（熔点高于450℃的钎料）。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条